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Technology Stocks : Rambus (RMBS) - Eagle or Penguin -- Ignore unavailable to you. Want to Upgrade?

To: Robert Jacobs who wrote (22547)	6/15/1999 11:05:00 AM
From: Estephen	Read Replies (1) \| Respond to of 93625

Tuesday June 15, 10:03 am Eastern Time biz.yahoo.com Company Press Release TI Delivers New Rambus Burn-in Test Sockets for Fast-growing RDRAM Market MANSFIELD, Mass.--(BUSINESS WIRE)--June 15, 1999--Texas Instruments' Interconnection Business today introduced new burn-in test sockets for Rambus(r) memory devices. The new products expand the number of sockets in TI's family of burn-in test solutions designed to test RDRAM(r) devices that are expected to become the mainstream memory standard. Rambus memory components are widely supported by the semiconductor industry. Endorsed by Intel and leading OEMs, Rambus memory devices are expected to attain over 30 and 50 percent of the DRAM market share in 2000 and 2001, respectively. Currently, more than 100 companies are committed to deliver Rambus technology within their products, including 15 DRAM manufacturers; over 20 logic IC suppliers; and 50 companies representing the leaders in system-memory implementation products. TI, the worldwide leader in burn-in test sockets, led the industry in February 1999 by becoming one of the first suppliers to develop a Rambus burn-in test solution. TI's Rambus DRAM (RDRAM) sockets feature a unique open-top design that minimizes solder ball damage, maximizes board density and process throughput, and adapts to a variety of package sizes. The sockets introduced in February accommodate popular RDRAM package foot prints such as center-load bonded, sized 0.8 x 1.0mm - 9x8, as well as edge-bonded packages, sized 0.75 - 16x7. TI's new sockets broaden the company's product line and enable manufacturers to accommodate smaller RDRAM devices - down to 0.75mm, with 0.5mm under development - and a greater range of input/output pins - 54, 62, 74 I/O. The new sockets also accommodate the high volume Rambus DRAM devices, including 64-, 72-, 128-, 144-, 256-, and 288-megabit devices. ''Today, TI is setting the pace for the Rambus DRAM market by giving manufacturers a broader selection of the most widely used burn-in test sockets in the industry,'' says Edmund F. Craig, III, sales and marketing manager for Texas Instruments' Interconnection Business. ''This is just one more step in our growing support of chip-scale package designs and the move into high volume manufacturing of fine pitch BGA burn-in test sockets for DRAM, SRAM, and flash memory customers.'' Socket Features Open-top, zero-insertion force suitable for automated load/unload. Reliable pinching action contact minimizes solder ball damage. Small socket outline to maximizes burn-in board density and process throughput. Low actuation force. Changeable adapters stage to allow a variety of package sizes. Fan-out interposer solves the tight pitch burn-in board interface challenge reducing the complexity of burn-in board designs and fabrication. Design Features Mechanical contacts touch each solder ball individually and independently. Contact protrusions pierce oxide on solder ball and give reliable contact. Contacts touch the upper side of the solder balls to minimize ball damage. Once the IC package is properly seated in the socket, latches clamp the IC package in position to prevent movement caused by vibration. Specifications Available in 0.75mm and 1.0 x 0.8mm pitch packages (0.5mm under development) 64/72/128/144/256/288 megabit RDRAM devices 54/62/74 input/output pins Socket sizes vary by application The new sockets are available in a range of sizes, including the following: Part Number I/O Pattern Pitch Socket size CBG074-042B 74 7x16 0.75 22x16.8x15.9 CBG062-048AR 62 9x12 1.0x0.8 19.5x24x17 CBG054-049AR 54 9x6 1.27 19.5x24x17 CBG074-041F 74 7x16 0.75 30.0x26.5x15.40 CBG074-042HAF 74 7x16 0.75 22.0x16.8x15.90 CBG062-046C 62 9x12 1.0x0.8 26.0x26.0x15.40 CBG054-046B 54 9x10 1.0x0.8 26.0x26.0x15.4 FBGA054-002A 54 9x10 1.0x0.8 25.0x21.5x16.20 The just-announced sockets from TI are being evaluated by RDRAM manufacturers in Asia, Europe and the U.S.A., and are expected to be in volume production by third-quarter 1999. Since TI's sockets utilize existing test equipment and standard processing, such as burn-in boards and ovens, market adoption should be strong. Texas Instruments Incorporated is a global semiconductor company and the world's leading designer and supplier of digital signal processing and analog technologies, the engines driving the digitization of electronics. Headquartered in Dallas, Texas, the company's businesses also include materials and controls, educational and productivity solutions, and digital imaging. The company has manufacturing or sales operations in more than 25 countries. Located in Mansfield, Mass., the Interconnection Business is part of TI's Materials & Controls group. Texas Instruments is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web at ti.com