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Technology Stocks : Rambus (RMBS) - Eagle or Penguin -- Ignore unavailable to you. Want to Upgrade?

To: Don Green who wrote (22714)	6/16/1999 8:35:00 PM
From: Brian1970	Respond to of 93625

News found on the Yahoo thread. I know the Yahoo threads are generally cruddy, but there are diamonds in all that sawdust... Now to the NEWS: 6/15/99 - TI Delivers New Rambus Burn-in Test Sockets for Fast-growing RDRAM Market ----------------------------------------------------------------- MANSFIELD, Mass., Jun 15, 1999 (BUSINESS WIRE via COMTEX) -- TexasInstruments' Interconnection Business today introduced new burn-in test sockets for Rambus(r) memory devices. The new products expand the number of sockets in TI's family of burn-in test solutions designed to test RDRAM(r) devices that are expected to become the mainstream memory standard. Rambus memory components are widely supported by the semiconductor industry. Endorsed by Intel and leading OEMs, Rambus memory devices are expected to attain over 30 and 50 percent of the DRAM market share in 2000 and 2001, respectively. Currently, more than 100 companies are committed to deliver Rambus technology within their products, including 15 DRAM manufacturers; over 20 logic IC suppliers; and 50 companies representing the leaders in system-memory implementation products. TI, the worldwide leader in burn-in test sockets, led the industry in February 1999 by becoming one of the first suppliers to develop a Rambus burn-in test solution. TI's Rambus DRAM (RDRAM) sockets feature a unique open-top design that minimizes solder ball damage, maximizes board density and process throughput, and adapts to a variety of package sizes. The sockets introduced in February accommodate popular RDRAM package foot prints such as center-load bonded, sized 0.8 x 1.0mm - 9x8, as well as edge-bonded packages, sized 0.75 - 16x7. TI's new sockets broaden the company's product line and enable manufacturers to accommodate smaller RDRAM devices - down to 0.75mm, with 0.5mm under development - and a greater range of input/output pins - 54, 62, 74 I/O. The new sockets also accommodate the high volume Rambus DRAM devices, including 64-, 72-, 128-, 144-, 256-, and 288-megabit devices. "Today, TI is setting the pace for the Rambus DRAM market by giving manufacturers a broader selection of the most widely used burn-in test sockets in the industry," says Edmund F. Craig, III, sales and marketing manager for Texas Instruments' Interconnection Business. "This is just one more step in our growing support of chip-scale package designs and the move into high volume manufacturing of fine pitch BGA burn-in test sockets for DRAM, SRAM, and flash memory customers."