Sharp and Conexant Accelerate Collaboration
on Advanced Semiconductor Process
Technology for Next Generation
Communications Products
Business Wire - June 21, 1999 08:22
OSAKA, Calif. and NEWPORT BEACH, Calif.--(BUSINESS WIRE)--June
21, 1999--Sharp Corporation and Conexant Systems Inc. (Nasdaq:CNXT)
today announced that the two companies will collaborate on deep-submicron
complementary metal oxide semiconductor (CMOS) process technology for
next-generation communications products.
Sharp and Conexant have been working together since early 1998 to align and
enhance their current semiconductor manufacturing processes, and are now
expanding that collaboration to accelerate the development of future process
technologies.
Sharp and Conexant estimate that the two companies have established
0.18-micron CMOS production capability at Sharp's facility in Fukuyama, Japan,
and Conexant's facility in Newport Beach, Calif., at least a quarter earlier than
would have been possible had the two companies been working independently.
Based on the past year's outcomes, Sharp and Conexant have agreed to extend
their collaboration to 0.15-micron process technology development, targeting
production release in the summer of 2000. Furthermore, Sharp and Conexant are
now focusing on the development of next-generation 0.12-micron process
technology.
"Collaborative efforts like these are valuable weapons in today's dynamic and
capital-intensive semiconductor manufacturing environment," said James Spoto,
Conexant's senior vice president, Platform Technologies. "In addition to
accelerating the production release of our jointly developed, leading-edge process
technology, we project total development cost savings of as much as $20 million
for each major step in the technology roadmap as Conexant and Sharp move to
0.15-micron technology and beyond."
"We are very pleased with our relationship with Conexant, and believe that our
accelerated collaboration will provide the cost-effective solutions that we require
for a wide variety of planned communications and consumer products," said
Terumasa Yoneda, Sharp's Corporate Executive Director and General Manager
of Integrated Circuits Group. "This collaboration will not only save millions of
dollars in R&D costs, but will also give both companies access to other critical
portfolio technologies related to mixed-signal integration, low-power BiCMOS,
system-on-a-chip capabilities, and embedded flash processes."
Conexant currently has two primary semiconductor manufacturing resources, one
in Newport Beach, and the second in Newbury Park, Calif., which specializes in
gallium-arsenide process technology for high-frequency wireless communications.
Currently Sharp also has two primary semiconductor manufacturing sites. One
located in Tenri, Nara-pref. mainly produces LCD Drivers and Bipolar ICs. The
other located in Fukuyama, Hiroshima-pref. mainly produces Flash Memories,
Mask ROM, CCD/CMOS Imagers and System LSIs.
Conexant Systems Inc. is the $1.2 billion company that was created when
Rockwell International spun off its semiconductor systems business to
shareowners in December 1998. Conexant is the world's largest independent
company focused exclusively on providing semiconductor products for
communications electronics. The company aligns its business into five product
platforms: Personal Computing, Personal Imaging, Wireless Communications,
Digital Infotainment and Network Access. With more than 30 years of experience
in developing analog modem technology, the company leverages its expertise in
mixed-signal processing and communications technology to deliver integrated
systems and semiconductor products for a broad range of communications
applications. These products facilitate communications worldwide through wireline
voice and data communications networks, cordless and cellular wireless telephony
systems, and emerging cable and wireless broadband communications networks.
Sharp Corporation is a worldwide developer of core digital technologies that are
playing an integral role in the emerging era of multimedia. As a leader in LCDs ,
optoelectronics, infrared devices and semiconductors including Flash Memories,
LCD drivers, CCD/CMOS Imagers and System LSIs, Sharp offers one of the
broadest and most advanced lines of consumer electronics, business products and
electronic components. Sharp provides a variety of creative solutions designed to
help increase productivity while providing functionality to meet customer demand.
Sharp Corporation currently employs about 65,000 people and has recorded
consolidated annual sales of over $14.0 billion for the fiscal year ended March 31,
1999.
Certain matters discussed in this news release regarding semiconductor
manufacturing technologies and related capabilities may constitute forward-looking
statements, such as discussions of product release dates, product availability,
market acceptance, cost savings and customer demand. Such forward-looking
statements involve certain risks and uncertainties, including the timely release of
products by manufacturing suppliers, the availability of components and
technologies from partners, suppliers and licensors, the acceptance of applicable
technologies, the impact of competitive markets, products and pricing, and other
risks detailed from time to time in the company's SEC reports, including the
reports on Form 10-Q for the quarter ending April 21, 1999. Actual results may
vary materially.
CONTACT: Conexant Systems Inc.
Tom Stites, 949/483-1492
thomas.stites@conexant.com
or
The Benjamin Group Inc.
Carolyn Fromm, 714/245-7500
carolyn_fromm@benjamingroup.com |
