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To: Paul Engel who wrote (84110)6/21/1999 6:07:00 PM
From: Doug M.  Read Replies (2) | Respond to of 186894
 
Paul,

"4. A Coppermine SLIP will most likely translate to a slip in the CAMINO/Rambus chipset/memory introduction."

Why do you believe this is so?

I am up to my chinny chin chin with Rambus stock/leaps and I follow it closely. Rambus/Camino were originally scheduled to be released independent of Coppermine in June. From what I understand Coppermine has always been a Q3 product for Intel. Therefore, Rambus was supposed to have worked with Intel's .25 micron PIII all along.

Judging from Rambus' recent stock price movement, the market isn't taking into account any further delay in Camino.

Also, I don't believe Intel wants to piss off the memory makers and supporting infrastructure companies anymore. Many of them have been ramping RDRAM and the associated RIMMS, connectors, testing devices, etc. in anticipation of the September launch of Camino. They're ready to go (albeit not in the volumes we'll be seeing at this time next year) and want to sell their products.

If the Katmai (.25 micron PIII) works with RDRAM why wait for Coppermine?

Regards,

Doug