To: MileHigh who wrote (23221 ) 6/21/1999 9:15:00 PM From: unclewest Read Replies (3) | Respond to of 93625
milehigh, this an example of a wonderful article imo. true rambus is not mentioned. but, if you put it in the context of all the press releases and ceo statements for the last few months of the companies involved, it sure smells like rmbs at least here and there and everywhere. everyone of these companies is involved with rambus somehow. most are deeply involved. unclewest Sony signs Conexant for process technology work By Anthony Cataldo EE Times (06/21/99, 7:29 p.m. EDT) OSAKA, Japan — Conexant Systems Corp. and Sharp Corp. have an extended their earlier agreement to jointly develop common semiconductor process technologies. The agreement, which could save each company millions in R&D spending, applies to process technologies below 0.18 microns. The deal illuminates a recent trend among Japan's consumer electronics companies to form tie-ups with electronics companies that have strong semiconductor orientations. "The purpose was first to shorten the development time and also to collaborate on the investment of the process technology," a Sharp spokesman said. "For the development of its 0.18-micron process, Sharp has saved $2 million and together both companies have saved $4 million." Sharp and Conexant had forged their initial agreement to develop a common 0.18-micron process technology in June 1998. That process technology should be completed by the end of this month. Under their latest agreement, the companies should complete their 0.15-micron process by the fourth quarter of 2000, and will possibly work out a similar deal for a 0.12-micron process, the Sharp spokesman said. For its part, Sharp intends to employ 0.15-micron devices in a number of emerging digital consumer electronics devices, including digital TVs, camcorders, electronic books, cellular phones with integrated TVs and wearable PCs. The two companies have further plans to co-develop intellectual property (IP) cores and system-on-chip designs. They will also work closely on joint production in a "virtual fab" arrangement in their effort to improve development and production efficiencies, according to Sharp. The Sharp-Conexant agreement comes after similar deals that some of Japan's consumer electronics companies have struck with semiconductor producers. These alliances have served as an economic salve in the recession-battered Japanese market, and have enabled companies to share the cost of increasingly complex deep-submicron process technology, and in some cases establish stronger customer-supplier relationships. For instance, Sony Corp. last year announced that it would work with Fujitsu Ltd. on a 0.18-micron process, and its subsidiary Sony Computer Entertainment Inc. later announced it had had signed with Toshiba Corp. to develop a 128-bit CPU for the next-generation Sony Playstation. Late last year, Matsushita and Mitsubishi Electric Corp. agreed to spend $430 million to co-develop process technologies for 0.15- and 0.13-micron devices. Also last year, Sanyo inked a deal with IBM Microelectronics to tap IBM's 0.25-micron and finer process technologies for a range of consumer products.