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To: Tom Warren who wrote (23323)6/22/1999 3:32:00 PM
From: Zeev Hed  Read Replies (1) | Respond to of 93625
 
Tom, only one comment, wafer scale integration will require solving some non trivial heat removal problems. Trilogy went down the drain on that one with 4" wafers, I would guess that 8" wafers (not talking about the next generation 12" wafers) would present problems that are far greater, particularly when design rules in the sub .25 microns and switching speeds approaching the GHz range are concerned (heat generation increases rapidly with switching speeds at each junction). I am working on some aspects of dynamic cooling of chips and that problem is far from trivial, particularly if one sticks to Olsen's philosophy "no plumbing in my computers". <g>

Zeev



To: Tom Warren who wrote (23323)6/22/1999 8:28:00 PM
From: Apollo  Read Replies (1) | Respond to of 93625
 
To the thread....

Thanx to all those who were kind enough to respond to Tony's comments from the G & K thread. Appreciate your insight and time. By the way, if you have read Moore's book on The Gorilla Game, I would recommend that thread. Very interesting, and some very bright investors/engineers.

Stan


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