Wednesday June 23, 8:29 am Eastern Time
Company Press Release
Asyst Unveils Industry's First Turnkey, Tool Automation Solution
FREMONT, Calif.--(BUSINESS WIRE)--June 23, 1999--
Open architecture Asyst Plus(TM) Platform integrates
state-of-the-art isolation and automation technologies to
deliver customized tool front-end solutions designed to
bridge the OEM and chipmaker gap
Asyst Technologies, Inc. (Nasdaq/NMS:ASYT - news), a leading supplier of advanced manufacturing solutions for the semiconductor industry, today introduced its new Plus(TM) Platform the industry's first turnkey, tool automation solution for today's most advanced semiconductor manufacturing. Featuring an open architecture that integrates the automation, isolation and information technology semiconductor device manufacturers demand, Asyst's Plus Platform responds to the emerging industry need for automated tool front-end solutions that enable seamless integration between original equipment manufacturers' (OEMs) production tools and advanced fab automation systems.
According to Anthony Bonora, Asyst's senior vice president and chief technology officer, escalating device complexity and cost are driving the demand for increased levels of automation and isolation in today's fabs. This, in turn, drives the need for complete front-end systems that can be built onto the semiconductor process tool to manage the transactions in moving wafers between the process tool and the factory floor.
Asyst stands alone in offering comprehensive product suites in all five of the core-technology areas needed to create complete tool automation solutions. These include automation software, auto identification (ID), loadports, environmental control and advanced robotics. In addition, the company has unparalleled OEM expertise with more than 250 OEM design wins, spanning 800 different tools and configurations over the past decade. As a result, Asyst is uniquely positioned to understand both OEM and chipmakers' requirements in addressing this evolving, high-growth market.
Dr. Mihir Parikh, Asyst's chairman and chief executive officer, noted that the Plus Platform is the first product capability to emerge from the company's automation group, formed last November to target the tool front-end market. ''This technology reflects our strategy to blend the expertise gleaned from extensive work with OEMs and chipmakers, with our deep understanding of how to manage valued customer assets in production and to deliver an integrated system that solves the unique needs of each customer including the need to boost manufacturing yields and productivity.''
Custom Solutions With A Universal Interface
Historically, tool front-ends have been developed through either fab retrofits, using diverse and often incompatible stand-alone products, or through custom OEM designs with proprietary interface technologies. As a result, these interfaces differ tool to tool and fab to fab with huge variances in both functionality and performance.
In contrast, Asyst's new Plus Platform product family ensures that the automation, robotics, information and isolation technologies are seamlessly integrated into a single, open-architecture platform that can meet the unique requirements of all process and metrology systems in the fab. This is achieved through a series of integrated building blocks that can be custom configured to meet the unique needs of each OEM and fab customer. In addition to offering a new level of connectivity between the process tool and factory floor, the Plus Platform represents a major step forward in addressing chipmakers' vision of a standard front-end interface across the factory floor.
Equally important are the benefits to the equipment manufacturers that will leverage this new platform to speed time to market for next-generation systems and technologies. By outsourcing this critical subsystem, OEMs can focus on their core competencies to develop leading-edge technologies that deliver a competitive edge while ensuring high reliability, functionality and commonality to the fab interface. OEMs also benefit from the Plus Platform's open-architecture design methodology, which ensures the design flexibility OEMs need to provide their global integrated circuit (IC) manufacturing customers with customized, mission-specific solutions.
THE PLUS PLATFORM ADVANTAGE
The Plus Platform incorporates multiple loadport (150 mm through 300 mm available), robotic and pre-aligner, auto ID, environmental control and software systems. The complete system fully integrates these critical functions into a turnkey material handling and factory automation interface for the full range of process and metrology tools. The system is designed to communicate with a supervisory controller and ultimately with the fab's in-house MES system.
In tailoring its Plus Platform to meet individual requirements, Asyst works in close partnership with both the OEM and fab customer to develop an optimized fab/process interface that complies with all SEMI and I300I standards and guidelines. To dramatically reduce design and prototype delivery time, Asyst leverages an extensive Pro-Engineer(TM) design library of building blocks that are utilized to configure these highly custom solutions to meet the specific needs of each fab and equipment supplier. The Plus Platform is available immediately.
Asyst reports that customer response to the new system has been extremely strong, as evidenced by the multiple orders already received and the escalating demo activity. Parikh added that in addition to opening up a new and potentially sizeable market for Asyst, the new Plus Platform is representative of Asyst's value management-based initiatives designed to expand the company's role as a complete solutions provider. ''Our entire portfolio is aimed at securing the integrity of chipmakers' wafers throughout the manufacturing cycle. This includes creating the proper process environment to ensure process integrity, designing material management to maintain lot integrity, automating wafer handling to eliminate human error and connecting all protocols and systems to establish communications integrity,'' concluded Parikh.
Except for statements of historical fact, the statements in this press release are forward-looking. Such statements are subject to a number of risks and uncertainties that could cause actual results to differ materially from the statements made. These factors include, but are not limited to, general economic conditions, semiconductor industry cycles, risks associated with the acceptance of new products and product capabilities and other factors more fully detailed in the Company's most recent Forms 10-K and 10-Q and annual report to shareholders.
About Asyst: Asyst Technologies, Inc. is the leading provider of advanced technologies designed to protect and enhance customers' valued assets throughout all phases of the manufacturing process. The company's comprehensive solutions set includes 200 and 300 mm product families that deliver state-of-the-art isolation, material management, robotics and software needed to ensure seamless factory automation in the most advanced fabs worldwide. Leveraging Asyst's value assurance technologies, OEMs are able to speed time to market and reduce development costs, while chipmakers are able to achieve greater fab profitability and productivity. Asyst's homepage is located on the World Wide Web at asyst.com
Note to Editors: Plus Platform is a registered trademark of Asyst Technologies, Inc. and Pro-Engineer is a registered trademark of Parametric Technology. All other trademarks mentioned herein are the property of their respective owners. Asyst Technologies, Inc. cannot guarantee the accuracy of the contents of this document and disclaims liability for any errors, omissions or future changes.
Editors Note: A copy of the Asyst PLUS Platform white paper is now available. If you are interested in receiving a copy, please contact Stephanie Huang at shuang@mcapr.com or at 650-968-8900 ext. 129
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