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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Process Boy who wrote (63257)	6/24/1999 9:56:00 PM
From: kash johal	Respond to of 1572507

PB, Re: "<I am hearing that Cu speeds up interconnect delays by 25-30%.> I take it this is specific to the K7 design." No. I have seen this stated by IBM, MOT, AMD and most recently by NEC. The key difference is the thickness and metal to metal spacing rules between different folks. I believe that Intel is not as agressive as the rest of the industry in metal pitch. Die sizes are bigger than other folks. But yield is higher with Intels approach. And the wire RC delays are lower with the Intel approach. So where folks are pushing their metal pitches the effects of Cu are much more prevalent- I believe that this explains at least to an extent the differences between approaches by Intel and rest of the industry. But I am sure you know all this. Regards, Kash