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Technology Stocks : Amkor Technology Inc (AMKR) -- Ignore unavailable to you. Want to Upgrade?

To: Stu Bishop who wrote (243)	6/27/1999 9:39:00 PM
From: schlep	Read Replies (1) \| Respond to of 1056

Here is a brief attempt: Traditional semi packaging consisted of internal wires bonded to the actual small pads on the chip (Si) and at the other end connected to the package lead frame (to pin) connected to the circuit board. Flip chip have the actual chips bonded via pads or sometimes bumps directly to the package substrate removing the need for the wire bonds. The substrate in most of the 'Ball Grid' modern technology would in turn be mounted on the circuit board via balls on the outside of the package. The benefit is lower inductance and therefore faster io timing. Also, 'Ball Grid' package technology enable higher manufacturing reliability to the end user and also provide the ability to have More IO signals on a given unit area of silicon. -schlep