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To: tuck who wrote (267)7/6/1999 1:48:00 PM
From: tech101  Respond to of 1056
 
Amkor Joins Standardizing Fresh Memory and SRAM Packaging

Monday July 5, 4:58 am Eastern Time

TOKYO, July 5 (Reuters) - Hitachi Ltd and Intel Corp (Nasdaq:INTC - news) have decided to join Sharp Corp and Mitsubishi Electric Corp in creating standard packaging for their computer chips, a Hitachi official said on Monday.

The companies will design a single package for stacking flash memory and static random-access memory (SRAM) chips, which will enable them to make smaller and lighter mobile phones and handheld information devices, he said.

Sharp and Mitsubishi Electric initially proposed shared specifications for their packages last September, the four companies said in a joint statement.

Seiko Epson Corp, Sanyo Electric Co Ltd , Mitsui High-tec Inc, Amkor Technology Inc (Nasdaq:AMKR - news) of the United States and Power Technology Inc will also support the specifications, the statement said.

Fujitsu Ltd , Toshiba Corp and NEC Corp agreed to different stacked chip package specifications last September.

biz.yahoo.com