KLA-TENCOR HELPS IC MAKERS BREAK THE COPPER YIELD BARRIER WITH FIRST PROCESS MODULE CONTROL SOLUTION FOR COPPER INTERCONNECTS
New CuPMC™ designed to speed copper development yield ramps to levels
currently attainable only through traditional aluminum processes
SAN JOSE, Calif., JULY 1, 1999-KLA-Tencor Corp. (Nasdaq: KLAC) today unveiled the industry's first process module control solution for copper interconnects, CuPMC™. Comprised of defect-reduction tools and parametric control systems, as well as classification/analysis software and solutions engineering expertise, KLA-Tencor's new CuPMC technology enables control over the critical process parameters that drive copper manufacturing success. This includes optimizing the lithography, deposition, etch and chemical mechanical planarization (CMP) process modules needed to create copper devices. Leveraging this solution, semiconductor manufacturers can speed technology development, optimize equipment characterization and accelerate the ramp to copper yield entitlement.
"The copper technology transition presents a serious challenge to semiconductor manufacturers," explained Tom Long, KLA-Tencor's vice president of corporate marketing. "Copper damascene structures, for instance, require the integration of new materials such as copper and low-k dielectrics, as well as new processes such as multi-level dielectric etching, copper seed/barrier layers, electrofilling high aspect ratio trenches and vias, and copper CMP. All of these new processes and materials create new inspection challenges and defect types that can seriously impact yield. Our CuPMC solution is designed to help our customers successfully overcome these integration challenges to rapidly achieve maximum yield in the development of their copper processes."
At the heart of KLA-Tencor's CuPMC solution are its integrated defect reduction and process parametric control systems. Integrating industry-leading optical and electron-beam-based inspection technology with comprehensive defect classification software, advanced SEM review tools and automated yield analysis systems, KLA-Tencor's defect reduction solution finds, filters and identifies yield-limiting signatures and sources quickly and automatically. Together with KLA-Tencor's process parametric control system, it offers the most comprehensive tool set and applications support for copper process development and yield optimization in the industry today.
According to Long, the company's CuPMC solution is the result of advanced applications development for the company's broad portfolio of inspection and metrology products. "Utilizing KLA-Tencor tools-resident in all of the major copper development fabs-we have been able to develop our CuPMC solution," said Long. "For example, KLA-Tencor's tool set helped UMC, a major Taiwanese foundry, quickly identify and source critical yield- and performance-related copper process integration issues. This allowed UMC to achieve copper yields comparable to those achieved with its aluminum processes."
KLA-Tencor's newly introduced eS20, the industry's first true in-line e-beam inspection tool for patterned wafer inspection, is the centerpiece of the CuPMC solution. Approximately 75 times faster than any other commercially available e-beam inspection tool, the eS20-combined with the company's suite of advanced optical inspection tools-enables the detection of new categories of yield-killing defects associated with copper damascene structures.
Another key ingredient in the CuPMC solution is KLA-Tencor's Sample Planner™ software. Sample Planner devises e-beam and optical inspection strategies that achieve the most favorable trade-offs between the cost of inspection operations and the risks of yield loss due to undetected yield-limiting defects and process excursions. It enables fabs to identify yield-critical, systematic and random defects and process excursions at every major process step. This information, combined with capture rates of defect types for both optical and e-beam inspection technologies, allows a customized, fab-wide inspection sampling strategy to be determined.
Sample Planner models the dynamics of a complete process line using both fab information and inspection strategy parameters. The information Sample Planner uses includes wafer starts, device average selling price, re-entrant flow, yield, defect propagation, inspection tool capability and rework decisions. Sample Planner can then answer questions such as type of inspection to use, which process steps and tools to use, inspection frequency, inspection sensitivity settings, statistical process control schemes to use, the fraction of defects to be reviewed and fab inspection capacity.
"We have amassed a wealth of expertise working with customers who are integrating copper processes into their fabs," commented Long. "As a result, we understand the unique challenges posed by copper. Our new CuPMC solution leverages that knowledge to support whatever copper manufacturing process tool set our customers choose to implement. As a result, customers are free to leverage highly differentiated copper processes to maintain a competitive edge, while still being assured of a rapid ramp to yield entitlement. We plan to introduce additional process module control solutions in the future to address other significant technology transitions as they occur."
Visit KLA-Tencor's Booth #426 at the Moscone Center in San Francisco, during SEMICON West 99 from July 12-14, to learn more about these exciting new products and technologies.
About KLA-Tencor: KLA-Tencor is the world leader in yield management and process control solutions for semiconductor manufacturing and related industries. Headquartered in San Jose, Calif., the company has sales and service offices around the world. An S&P 500 company, KLA-Tencor is traded on the Nasdaq National Market under the symbol KLAC. Additional information about the company is available on the Internet at kla-tencor.com
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CuPMC and Sample Planner are trademarks of KLA-Tencor.
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