Ultratech Unveils Lithography Product for Bump (flip-chip) Process Applications
Business Wire - July 12, 1999 08:45
SAN JOSE, Calif.--(BUSINESS WIRE)--July 12, 1999--
Saturn Spectrum 3 brings front-end lithography technology to advanced consumer packaging applications
Ultratech Stepper, Inc. (Nasdaq NM:UTEK), a leading supplier of photolithography systems used to manufacture semiconductors, micromachining devices and thin film heads (TFH) for disk drives, today announced the introduction of the Saturn Spectrum 3 -- the first lithography tool designed specifically for bump (flip-chip) process applications. The system was developed in collaboration with Casio Computer Co. Ltd., a global leader in the electronic consumer arena and significant user of bump technology. The new wafer stepper marks Ultratech's introduction of advanced technology for semiconductor packaging applications and further expands Ultratech's range of lithography solutions to cost-conscious customers.
"Ultratech once again demonstrates its cost-effective technology leadership in the industry -- this time with a product designed specifically to meet the advanced lithography requirements of bump (flip-chip) process applications," said Daniel Berry, Ultratech's president and chief operating officer. "More importantly, the introduction of the Saturn Spectrum 3 signals an exciting strategic development for our company as we extend our core competency in lithography to advanced semiconductor packaging applications. This product is designed to offer customers a technically-sophisticated solution to their bump (flip-chip) process requirements, with the cost-of-ownership advantages chipmakers require in the face of increasing fab costs."
Commenting on the new Saturn Spectrum 3, Casio's project leader of the Research Center, Takeshi Wakabayashi said, "With our company turning its strategic attention to wafer-level, chip-size packages, it was necessary to seek a partner who could provide advanced lithography technology and expertise together with a reliable global customer support network. Ultratech has a consistent track record of producing high-performing, high-yield tools with the added advantage of low capital costs. We're pleased to select them as our partner in this new endeavor."
Ultratech's alliance with Casio was critical to the successful delivery of the system, according to Berry. "The increasing demand for versatile, high-performing lithography tools requires across-the-board global technology cooperation. Fostering these corporate partnerships has always been a big part of Ultratech's diversification strategy and in this case we have leveraged our combined technical knowledge to generate a tool that we believe meets the advanced requirements for bump (flip-chip) processing applications."
The Saturn Spectrum 3 is a unique wafer stepper that offers flexibility and cost-effective advantages for advanced thick-film lithography applications. This is the first system to utilize Ultratech's new exclusive broadband ghi-line optics technology, and the company believes it is capable of processing any g or i-line photosensitive film from 1.0 micron to more than 100 microns thick on the same stepper. With 2.0-micron resolution and a usable depth-of-focus of greater than 5.0 microns, the system provides a high degree of process latitude. It is equipped with a fully automatic wafer-size change feature that allows back-to-back processing of wafers ranging from four to eight inches in diameter. In addition, its high wafer-plane irradiance results in low exposure times and high throughput at high dose exposures. With its advanced Machine Vision System (MVS), a pattern-recognition-based alignment system, the need for dedicated targets is eliminated and integration with existing processes is simplified.
"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Certain of the statements contained herein may be considered forward-looking statements that involve risks and uncertainties, such as the cyclicality in the thin film head and semiconductor industries, competition, lengthy sales cycles for the company's systems, pricing pressures, the mix of products sold, delays, deferrals and cancellations of orders by customers, manufacturing inefficiencies and absorption levels, ability to volume-produce systems and meet customer requirements, dependence on new product introductions and commercial success of any new products, integration and development of the UltraBeam and Verdant operations, risks associated with introducing new technologies, inventory obsolescence, adjustments relating to the potential change in accounting for the ISI acquisition, the failure to develop and commercialize the ISI products, delays in collecting accounts receivable, extended payment terms, economic and political conditions in Asia and changes in technologies. Such risks and uncertainties are set forth in the company's SEC reports, including the company's Annual Report on Form 10-K for the period ended December 31, 1998, and its Form 10Q for the period ended March 31, 1999.
About Ultratech: Founded in 1979, Ultratech Stepper, Inc. designs, manufactures and markets photolithography equipment used worldwide in the fabrication of integrated circuits, micromachining devices, thin film heads for disk drives and photomasks for the semiconductor industry. The company produces products that substantially reduce the cost of ownership for manufacturers in the electronics industry. The company's home page on the World Wide Web is located at ultratech.com
CONTACT: Ultratech Stepper, Inc.
Laura Rebouche, 408/321-8835
Fax: 408/577-3379
email: lrebouche@corp.ultratech.com
or
MCA
Jane Evans-Ryan, 650/968-8900
Fax: 650/968-8990
email: jryan@mcapr.com
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