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Technology Stocks : LSI Corporation -- Ignore unavailable to you. Want to Upgrade?

To: Mike Hermann who wrote (19259)	7/12/1999 9:12:00 AM
From: Paul Lee	Respond to of 25814

LSI Logic Licenses EPGBA and CSP Package Technology to Hana Technologies Ltd. Agreement Enables Industry-Wide Packaging Standards MILPITAS and SAN JOSE, Calif., July 12 /PRNewswire/ -- LSI Logic Corporation (NYSE: LSI) and global packaging leader Hana Technologies Ltd. (HTL), today announced that Hana is licensing LSI Logic's Enhanced Plastic Ball Grid Array (EPBGA) and Chip Scale Package(CSP) technologies. The definitive agreement allows Hana to provide high-volume, high-quality production packaging solutions to its customer base by utilizing LSI Logic's industry leading packaging technology. The endorsement from Hana is another step in a series establishing LSI Logic's packaging technology as an industry standard. "LSI Logic is setting the standard for advanced packaging technology," said Maniam Alagaratnam, LSI Logic's vice president of Package Development. "The combined strengths of LSI Logic and Hana Technologies provide high-performance system-on-a-chip (SOC) package designs in the most reliable and most robust package construction available." "We are very pleased to see our relationship with LSI Logic move in this direction," said Hubert Meier, managing director of HTL. "LSI Logic's market-driven package development is perfectly aligned with our strategy to bring in-demand emerging technologies to high volume production levels quickly, reliably and cost effectively." The EPBGA package construction utilizes a four-layer BT laminate substrate which incorporates full power and ground planes, optimized routing for excellent electrical performance, aggressive die size support, and power and ground rings on the bonding layer for design flexibility and enhanced performance. In addition, the package can be customized to have split power planes to accommodate multiple I/O voltages. The design of the EPBGA provides low capacitance and inductance characteristics ideal for high-speed applications particularly in computing and networking. The EPBGA is available in ball counts ranging from 313 to 731 balls. The chip scale package is a wire bonded package that utilizes a polyimide tape as the substrate which permits finer geometries than a laminate substrate therefore allowing more signals for the same body size. Additionally, the overall package thickness is reduced making it ideal for mobile and consumer applications which require small form factor packages. The CSP is available in ball counts ranging from 112 through 280. LSI Logic's Advanced Package Technology LSI Logic offers a robust portfolio of package solutions for system-on-a-chip designs. The portfolio includes a diverse selection of leaded and laminate (BGA) type packages extending from a 2 layer laminate to an 8 layer high-perfomance flip chip. In addition, LSI Logic continues to provide a QFP family of packages including standard (PQFP), thermally enhanced (PQFPt) and small form factor (TQFP) packages. "As part of its system-on-a-chip strategy, LSI Logic has moved aggressively to develop advanced packaging technology designed to meet the requirements of deep submicron semiconductor designs tailored to a broad range of applications," said Dilip Mathew, marketing manager, ASIC Technical Marketing. "This agreement with Hana enhances LSI's capability to meet growing demand for leading edge packaging solutions."