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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Steve Porter who wrote (65057)	7/13/1999 12:05:00 PM
From: Kevin K. Spurway	Read Replies (1) \| Respond to of 1579998

Re: "I am aware that the K6-2 would require a re-layout to go to a wire-bonded type of 'connection'." Doesn't AMD make embedded versions of the K6 already? Certainly these aren't ceramics packaged? Kevin

To: Steve Porter who wrote (65057)	7/13/1999 12:06:00 PM
From: Saturn V	Respond to of 1579998

Ref - Moving K-62 to plastic wire bond package I do not think it makes sense for AMD to use up precious design resources to relayout the K-62 for wire bonded packaging. The Vcc and Vss wire bond inductance problem is severe. Beyond 400-500 Mhz, you almost run into a wall. Several hundred output buffers switch simultaneously, and the corresponding 'spike currents' reduces the voltage dramatically (due to the parasitic inductance), degrading speed. The chip designers are working very hard to combat this problem. If the objective is to cut cost, it will be a safer bet for AMD to copy Intel's OLGA package, which performs flip chip bonding on an organic substrate. It will probably save $10-$15 in package cost,and will not suck up design resources.