can anyone help me figure this out?
we know that ti is out of the dram business. they are using rambus tech in telephone equip. they are negotiating for an arm core license.
this article talks about burn in sockets and rambus and smaller rdram devices. then it talks about cell phones, video games and digital cameras. does anyone see a connection here? is my prediction coming true?
SAN JOSE, Calif.--(BUSINESS WIRE)--July 13, 1999--Texas Instruments Interconnection Business is showcasing new additions to its popular line of burn-in test sockets for the full range of semiconductor products at SEMICON West '99. TI Interconnection Business is a global leader in the critical back-end process for burn-in test, providing manufacturers of ASIC, logic, memory chips and microprocessors a proven method for ensuring their products are fully tested and burned-in before they are integrated in a host of electronic products.
At SEMICON West, TI will feature burn-in test sockets that serve manufacturers of cell phones, video games, digital cameras and the red-hot sub-$1000 PC market.
New for SEMICON, TI is showcasing its newly expanded line of burn-in test sockets for the Rambus(r) DRAM market. Currently, eight of the world's top-10 semiconductor companies license Rambus technology and seven of the world's top PC makers have shipped systems using the technology. TI leads the market with sockets that accommodate smaller RDRAM devices - down to 0.75mm - a greater range of input/output pins - 54, 62, 74 I/O - and a wider variety of high volume RDRAM devices, including 64-, 72-, 128-, 144-, 256-, and 288-megabit devices.
Also at SEMICON, TI is introducing a new custom-built burn-in test solution for Pin Grid Array. The PGA is ideally suited for the fast-growing sub-$1,000 PC market because it optimizes the amount of technology and processing power on each microprocessor. This makes it less costly to produce and better suited to the growing market for low-end personal computers.
The new PGA and Rambus DRAM burn-in test sockets use TI's patented open top, auto-load/unload, zero-insertion force design and feature a changeable adapter to accommodate a variety of package sizes.
The new sockets add to TI's solutions for the full range of package designs, which include CSP, BGA, KGD, QFP, SOJ, SOP, TSOP and LGA.
TI is also giving a presentation at SEMICON's 2nd Annual Semiconductor Packaging Technologies Symposium. At his presentation titled, "Burn-in Test for Memory Chip Scale Packages," Dr. James Forster will describe the process used to develop a new socket, from the definition of the requirements, through prototyping, to initial production. Socket design challenges will also be discussed along with what must happen for the industry to move to the next smallest package-size, 0.5mm. Dr. Forster's presentation will take place during the Chip Scale Packaging Assembly Session scheduled from 9 a.m. to 12 p.m. on July 13 at the San Jose Hilton & Towers.
For more information or to schedule a briefing, contact Lynda Armstrong at Texas Instruments Interconnection Business at (508) 236-5388 or stop by the TI Interconnection Business booth #16104, San Jose Convention Center, The Tent.
Editor's Note:
Texas Instruments Incorporated is a global semiconductor company and the world's leading designer and supplier of digital signal processing and analog technologies, the engines driving the digitalization of electronics. Headquartered in Dallas, Texas, the company's businesses also include materials and controls, educational and productivity solutions, and digital imaging. The company has manufacturing or sales operations in more than 25 countries.
Located in Mansfield, Mass., the Interconnection Business is part of TI's Materials & Controls group.
Texas Instruments is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web at: ti.com.
CONTACT:
Bridgeman Communications
Dan Dent, (617) 742-7270
dan@bridgeman.com
or
Texas Instruments
Lynda Armstrong, (508) 236-5388
larmstrong@ti.com
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