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Technology Stocks : Kulicke and Soffa -- Ignore unavailable to you. Want to Upgrade?

To: twt who wrote (3405)	7/16/1999 4:50:00 PM
From: Ted The Technician	Respond to of 5482

>>Who is KLIC's competitor? From KLIC's 10K filings: The semiconductor equipment and packaging materials industries are intensely competitive. Significant competitive factors in the semiconductor equipment market include process capability and repeatability, quality and flexibility, and cost of ownership, including throughput, reliability and automation, customer support and price. The Company's major equipment competitors include Shinkawa, Kaijo, ESEC and ASM Pacific Technology in wire bonders; ESEC, Nichiden, ASM Pacific Technology and Alphasem in die bonders; and Disco Corporation in dicing saws. Significant competitive factors in the semiconductor packaging materials industry include price, delivery and quality. Major competitors in the packaging materials line include Gaiser Tool Co. and Small Precision Tools, Inc. with respect to expendable tools, Tanaka Electronic Industries and Sumitomo Metal Mining in the bonding wire market, and Disco Corporation with respect to dicing blades.

To: twt who wrote (3405)	7/16/1999 8:57:00 PM
From: Jerome	Read Replies (1) \| Respond to of 5482

"What is your expectations for earnings?" Depending on the source I found the following. Stockselector.com shows expected earnings of -.08 for this quarter and +.14 for the next quarter. SI Beta site shows -.03 for this quarter and +.37 for the next quarter. I don't know what first call is projecting. My expectations are that they will slightly beat estimates this quarter and give a good forward looking outlook for the next quarter. Thanks to the technician for answering your questions about the competition. He did a better job than I could. I wouldn't know a ball bonder from a bail binder. That's the nice thing about these discussion groups there are people who really do know what they are talking about. Have a good week end.....Jerome