To: ScotMcI who wrote (22677 ) 7/23/1999 9:35:00 AM From: ScotMcI Read Replies (1) | Respond to of 25960
ASML Announces Development Program to Extend Optical Lithography to 157 nm; Lithography Leader Initiates Industry-Wide Effort to Develop 157 nm Solution by 2003 VELDHOVEN, The Netherlands--July 1, 1999--ASM Lithography (ASML) (Nasdaq:ASML) formally announced today an active 157 nm technology development program to extend imaging capabilities beyond 193 nm technology. The program's goal is to deliver production lithography systems by the year 2003 for leading-edge IC developments. The 157 nm program will facilitate research activities among ASML's strategic technology partners, including Carl Zeiss for 157 nm optics. At International Sematech's advanced lithography critical review meeting in Chicago last month, industry members sanctioned 157 nm lithography as an important candidate for printing semiconductor circuit linewidths smaller than 100 nm. A key benefit of extending optical lithography to 157 nm technology is that this patterning process comes with a proven industry infrastructure and manufacturing capability. Next-generation technologies beyond optical lithography will require the industry to assume much more manufacturing risk. "Developing a 'whole product' solution for 157 nm lithography will require a focused, industry-wide effort," said Bill Arnold, ASML's executive scientist. "This undertaking, whose impact will be felt throughout the global semiconductor business, is beyond the resources of any single company." "ASML, our strategic optics partner Carl Zeiss, optic materials supplier Schott, and laser suppliers Cymer and Lambda Physik are committed to meeting the technical challenges," Arnold added. "However, the business factors are less clear, so we are actively soliciting investments of technical resources and participation from photoresist suppliers, reticle manufacturers, and all parties that have a role in continuing to shrink the design rules of advanced semiconductor devices. Also it is anticipated that key customers will participate in launching the program." Initial design studies by ASML and Carl Zeiss indicate that it is technically feasible to build a very high numerical aperture (NA) lens that will enable a 157 nm system to achieve greater resolution and process latitude than is possible with 193 nm technology. Beyond the exposure system, however, other technical and business challenges remain in pioneering a complete 157 nm lithography solution. For example, photoresist and process developments would have to be completed within a time frame that is much more accelerated than the industry has ever before attempted. To assist in this process development work, ASML is investigating, together with the microelectronics research organization IMEC, the feasibility of starting a 157 nm process development program, to help their customers with a fast ramp up of this technology. ASML expects to complete design concept studies for a 157 nm lithography system by the middle of next year, and to begin preparing the infrastructure for system development and prototyping, with the goal of shipping the first 157 nm production systems to leading-edge IC development groups by 2003. About ASML