This sounds pretty good:
Broadcom Delivers Custom Chip for 3Com's Next-Generation
NIC Solution
IRVINE, Calif.--(BUSINESS WIRE)--August 2, 1999--
Single-Chip Network Interface Card (NIC) Leverages Broadcom's Mixed
Signal Custom Integration Capabilities
Broadcom Corporation (Nasdaq:BRCM), a leading provider of integrated
circuits enabling broadband communications to and throughout the home and
business, today announced that 3Com's next-generation, high-volume
EtherLink XL 10/100 PCI Network Interface Card uses an advanced,
custom-integrated controller from Broadcom. This device is the latest
solution to be co-developed by the two companies for the Ethernet NIC and
LAN-on-Motherboard (LOM) markets.
The Broadcom(R) single-chip controller leverages Broadcom's Customized
Communication Integrated Circuit(TM) (CCIC) capability and signifies
another milestone in its CCIC product offering. This controller delivers
industry-leading performance, manageability, and functionality, such as
remote system alerts, remote wake-up and an Advanced Configuration and
Power Interface (ACPI). To date, 3Com has qualified Broadcom's custom
chip for both the PC OEM and the distribution sales channels.
"Our relationship with Broadcom has helped us achieve new levels of
integration, cost and time-to-market for our network interface offerings," said
Kirk Blattman, Director of Engineering for 3Com. "By implementing
Broadcom's robust and reliable Digi-PHY(TM) core, we will continue to
provide our customers with best-of-breed solutions that simplify their
networks through intelligence at the edge."
"3Com's market and technology leadership, manufacturing capability, and
keen focus on quality and cost make them a natural participant in our CCIC
program," said Marty Colombatto, Vice President and General Manager for
Broadcom's Networking Business Unit. "We are now taking the relationship
to the next level, and are already developing future generations of custom
products with enhanced functionality and performance."
Broadcom has a world-class, full-custom IC development methodology that
includes the design, test and manufacturing of highly complex mixed-signal
devices from concept through high-volume production. Over the past several
years, Broadcom has enhanced this advanced design process, resulting in
extremely cost-effective, system-on-a-chip solutions, which integrate
customers' intellectual property (IP) with Broadcom's proprietary
BroadCore(TM) broadband transmission cores. The company's portfolio of
BroadCore technology is derived from it's leadership position in a variety of
digital communication markets such as the digital cable set-top box, cable
data modem, enterprise networking, home networking, xDSL modem and
wireless broadband markets.
To complement its advanced mixed-signal design methodology and
broadband transmission cores, Broadcom offers an extensive library of
communication-centric design elements consisting of high-performance
analog, transistor-optimized compiled DSP, dense memory blocks, embedded
processors, and a wide assortment of I/Os all of which are designed,
supported and maintained in-house.
The digital nature of Broadcom's 10/100BASE-T Digi-PHY core enables
system-level integration by eliminating the adverse effects of combining
high-performance analog and digital on the same chip. Unlike competitive
analog-based solutions, the digital nature of Broadcom's Digi-PHY core
makes it highly testable and less susceptible to process, temperature, and
voltage variations, thereby achieving high manufacturing yields and quality
levels equivalent to standard digital logic Application Specific Integrated
Circuits (ASIC).
Broadcom's Digi-PHY core has been successfully implemented in multiple
single-poly process technologies, ranging from 0.5 to 0.22 microns, making it
the ideal candidate for cost-effective ASIC integration. The field-proven
Digi-PHY core architecture, which is the basis for all of Broadcom's
10/100BASE-T custom and standard products, ensures robust performance
and interoperability over a broad range of operating conditions. It has been
used in many generations of Fast Ethernet products shipping over 35 million
ports to all leading networking customers worldwide.
About Broadcom
Broadcom Corporation is a leading provider of highly integrated silicon
solutions that enable broadband digital transmission of voice, data and video
content to and throughout the home and within the business enterprise. Using
proprietary technologies and advanced design methodologies, the company
designs, develops and supplies integrated circuits for some of the most
significant broadband communications markets, including the markets for
cable set-top boxes, cable modems, high-speed office networks, home
networking, direct broadcast satellite and terrestrial digital broadcast, and
digital subscriber line (xDSL). Broadcom is headquartered in Irvine,
California, and may be contacted at 949-450-8700 or at www.broadcom.com.
Safe Harbor Statement of Broadcom Corporation under the Private
Securities Litigation Reform Act of 1995:
This release may contain forward-looking statements based on our current
expectations, estimates and projections about our industry, management's
beliefs, and certain assumptions made by us. Words such as "anticipates,"
"expects," "intends," "plans," "believes," "may," "will" and similar
expressions are intended to identify forward-looking statements. These
statements are not guarantees of future performance and are subject to certain
risks, uncertainties and assumptions that are difficult to predict. Therefore,
our actual results could differ materially and adversely from those expressed
in any forward-looking statements as a result of various factors.
Important factors that may cause such a difference for Broadcom in
connection with its CCIC high-speed networking program include, but are not
limited to, the volume of our product sales and pricing concessions on volume
sales; the timing, rescheduling or cancellation of significant customer orders;
the loss of a significant customer; the qualification, availability and pricing of
competing products and technologies and the resulting effects on sales and
pricing of our products; our ability to specify, develop, complete, introduce,
market and transition to volume production new products and technologies in
a timely manner; the timing of customer qualification and industry
interoperability certification of new products and the risks of
non-qualification or non-certification; the rate at which our present and future
customers and end-users adopt new and emerging technologies in the
high-speed networking markets; the rate of adoption and acceptance of new
industry standards in the foregoing markets; wafer pricing and the availability
of foundry capacity and raw materials; fluctuations in our manufacturing
yields and other problems or delays in the fabrication, assembly, testing or
delivery of our products; problems or delays that we may face in shifting our
products to smaller geometry process technologies and in achieving higher
levels of design integration; the risks and uncertainties associated with
international operations; intellectual property disputes; our ability to retain
and hire key executives, technical personnel and other employees in the
numbers, with the capabilities, and at the compensation levels needed to
implement our business and product plans; changes in our product or customer
mix; the quality of our products; potential business disruptions, claims,
expenses and other difficulties resulting from "Year 2000" problems in
computer-based systems used by us, our suppliers or our customers; general
economic conditions and specific conditions in the markets we address; and
other factors.
Our recent Annual Report on Form 10-K, recent and forthcoming Quarterly
Reports on Form 10-Q, and other Securities and Exchange Commission
filings discuss some of the important risk factors that may affect our business,
results of operations and financial condition. We undertake no obligation to
revise or update publicly any forward-looking statements for any reason.
Broadcom(R), Digi-PHY(TM), BroadCore(TM), Customized Communication
Integrated Circuit(TM), and the pulse logo are trademarks of Broadcom
Corporation and/or its subsidiaries.
3Com and EtherLink are registered trademarks of 3Com Corporation.
CONTACT: Broadcom Public Relations Contacts
Trade Press
Laura Brandlin
Director, Marketing Communications
949/450-8700
lbrandlin@broadcom.com
or
Broadcom Technical Contact
Fred Taylor
Product Line Manager
949/450-8700
ftaylor@broadcom.com
or
Business Press
Bill Blanning/Cristine Morris
Corporate Communications Department
949/450-8700
blanning@broadcom.com/cmorris@broadcom.com
or
Investor Relations Contact
Esteban Torres
949/585-5663
etorres@broadcom.com |
