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Technology Stocks : Intel Corporation (INTC) -- Ignore unavailable to you. Want to Upgrade?

To: Paul Engel who wrote (86513)	8/2/1999 5:04:00 PM
From: Proud_Infidel	Respond to of 186894

Intel to open semiconductor packaging R&D center in Arizona By Jack Robertson Electronic Buyers' News (08/02/99, 04:04:17 PM EDT) Intel Corp. is converting its chip assembly and test operation in Chandler, Ariz., to an advanced packaging R&D center, the only such facility in the U.S., a spokeswoman said today. The shift from a back-end production operation will result in the elimination of 60 of the 900 positions at the assembly facility. The spokeswoman said the workers laid off are expected to find other positions within Intel. The move indicates Intel's increased interest in advanced chip packaging, including bare die, chip-scale packaging, flip chip, and various types of ball-grid-array packages. The spokeswoman said Chandler was a natural choice for the bare-die R&D center, because the facility has been responsible for Intel's bare-die development and marketing for many years. The assembly and test work formerly done at Chandler will be moved to other Intel fab locations. The company's Fab 12, a front-end facility that manufacturers Pentium microprocessors, and Fab 6, which produces microcontrollers, will continue to operate in Chandler with no changes. The new R&D packaging effort could play a major role within Intel and elsewhere as the company moves aggressively to smaller BGA configurations, including flip chip. Sources said Intel has deferred for another year plans to introduce a flip-chip PBGA package for the Pentium III, a device known as the FC-PGA 418. The Chandler R&D center is expected to continue developing that flip chip package, as well as other CSP configurations. ebnews.com