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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?


To: Petz who wrote (69586)8/23/1999 2:42:00 AM
From: Process Boy  Respond to of 1574097
 
Petz - <2)Intel's potential gain of 10% in MHz didn't appear to be necessary to stay on top of the heap in 0.18æ;>

There are a host of other reasons why Intel is not Cu at .18, primarily concerning the manufacturability of Cu early in the learning curve. I.e., potential yields on Cu for the .18 generation are quite suspect, due to immaturity of the required tool sets. Weighing this with estimated potential performance gains of <10% tipped the scales in favor of Al. A good choice, IMHO.

PB



To: Petz who wrote (69586)8/23/1999 2:57:00 AM
From: Bill Jackson  Read Replies (1) | Respond to of 1574097
 
Petz, That seems logical. What about the extra crosstalk at closer spacings?, do they cut that with the low (capacitive property) insulating layers?Some kind of porous oxide?

Bill



To: Petz who wrote (69586)8/23/1999 3:14:00 AM
From: Pravin Kamdar  Respond to of 1574097
 
Petz,

dropping geometry down by 28% (0.25 to 0.18) reduces capacitance down by 48% (proportional to size**2)

Perhaps you should consider this statement again.

Also, I believe the main problem with coupling when going to smaller geometries is between the sidewalls of parallel lateral traces, due to the height (or thickness) of the traces needed as widths decrease.

Pravin.