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To: Duker who wrote (3275)	8/30/1999 3:31:00 AM
From: Duker	Respond to of 5867

TI taps M+W to complete initial 300-mm fab cleanroom semibiznews.com A service of Semiconductor Business News, CMP Media Inc. Story posted 2:45 p.m. EST/11:45 a.m., PST, 8/27/99 DALLAS -- Germany's M+W Zander Facility Engineering GmbH today announced it has won a $50 million contract from Texas Instruments Inc. to design and construct a cleanroom inside TI's DMOS-6 wafer fab here. Built more than a year ago, the DMOS-6 facility is scheduled to become TI's first 300-mm wafer fab with the initial phase of cleanroom setup to be completed in the first half of 2000, according to M+W Zander. TI, like other chip makers, opted to postpone its move to larger 300-mm wafers while the industry worked it way through a fab-capacity glut last year. M+W Zander designed the DMOS-6 facility and will now complete the work on the building's initial cleanroom through its Meissner+Wurst U.S. operations. The project is the sixth wafer fab that M+W Zander has built for TI, according to the Stuttgart-based company. Last year, TI announced it would use the DMOS-6 facility to produce 0.13-micron [drawn feature size] ICs with a copper interconnect option using 300-mm wafers. A spokeswoman for TI in Dallas today said the company was now entering the cleanroom design-and-construction phase of the DMOS-6 fab. She said installation of 300-mm equipment will probably occur by the end of next year with volume production of digital signal processors (DSPs) and analog ICs beginning in the second half of 2001. --J. Robert Lineback

To: Duker who wrote (3275)	8/30/1999 6:17:00 PM
From: Jong Hyun Yoo	Read Replies (1) \| Respond to of 5867

Yes.. I agree Bagley has done a marvelous job of turning around the company. Many people are excited about the recent turnaround of LAM into a profitable company. However, I am more excited about the tremendous growth potential this company has with this mean and efficient operating structure. Even though we are experiencing a little pullback in the share price due to concern over growth rate of new order, I am convinced that we will see a very robust growth of new order near the year end and early next year. By the way, it seems like LAM is really focusing its marketing strategy in capturing back the oxide etch market. I heard that LAM is developing New HDP etch tool for critical oxide etch applications. It is going to be much improved tool from current 9100 PTX. Expect some news from LAM towards the end of this year..