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To: MileHigh who wrote (28929)	9/7/1999 9:02:00 PM
From: Jdaasoc	Respond to of 93625

MH: More of Taiwan is making RDRAM. from semibiznews,com Tessera packages new deals, announces new CEO A service of Semiconductor Business News, CMP Media Inc. Story posted 2 pm. EST/11 a.m., PST, 9/7/99 SAN JOSE -- Tessera Inc. here said today that it has licensed ChipMOS, a Taiwan-based semiconductor packaging and testing company, to manufacture Tessera's Micro Ball Grid Array chip-scale packages. At the same time, Toshiba Corp. said it will use the Micro BGA technology for its Direct Rambus DRAMs. Tessera also today announced the appointment of a new president and CEO, Bruce McWilliams, formerly chairman of S-Vision Inc., a company that pioneered in silicon microdisplays. McWilliams actually joined Tessera earlier this summer but the company had not officially announced the move. "We are pleased to announce the addition of ChipMOS to the family of Tessera licenses," McWilliams said. "ChipMOS is recognized by IC companies worldwide as a quality provider of reliable chip packaging and testing." ChipMOS joins Amkor Technology, ChipPAC, and Siliconware Precision, among others, as one of Tessera's MicroBGA contract assembly licensees. ChipMOS, headquartered in Tainan, plans to ramp production rapidly to meet the demand for Micro BGA technology for next-generation memory, especially Direct RDRAMs. According to Tessera, most Rambus licensees are packaging their RDRAMs using the Micro BGA technology. Toshiba has decided to use a variation of the standard Micro BGA technology, which uses wirebonds as opposed to the more standard integral bond leads used by most of Tessera's licensees. Chips using Tessera's CSP technology can be mounted on both sides of a Rambus-in-line memory module (RIMM), which enable modules with capacities of 256 and 288 megabytes. According to McWilliams, "The rapid acceptance of Micro BGA packaging is based on several factors, including the ease with which the technology fits into the existing infrastructure for surface-mounted IC assembly and packaging materials." McWilliams has been serving as president and CEO of Tessera since June, replacing John Smith, who was named vice chairman. McWilliams co-founded S-Vision in 1996 and has 18 years of technical experience in display and semiconductor technology, electronic packaging, and contract manufacturing. He was a senior vice president at Flextronics International, and was president and CEO of nCHIP Inc., which he co-founded in 1989. McWilliams also led a team at Lawrence Livermore National Laboratory that focused on electronic packaging, laser processing of semiconductors and optical systems for target tracking. At Tessera, McWilliams will direct the company's strategic efforts to offer "no-compromise package technology solutions" that can be applied to almost all end-use applications that benefit from smaller form factors, faster performance and less cost. "We have a unique business model designed to provide Tessera's clients with a competitive edge while earning the best return on our intellectual property," said McWilliams. "In addition to our core technology licensing, we offer our customers a portfolio of value-added services that enable rapid deployment and productization of leading edge packaging technology."