ULTRATECH SECURES MILLION-DOLLAR ORDER FOR FIRST SATURN SPECTRUM 3 FROM CASIO COMPUTER CO., LTD.
9/15/99 8:25:39 AM
SAN JOSE, Calif., Sep 15, 1999 /PRNewswire via COMTEX/ -- Ultratech
Stepper, Inc. (Nasdaq: UTEK), a leading supplier of photolithography
systems used to manufacture semiconductors, micromachining devices and
thin film heads (TFH) for disk drives, today announced the first order
for its latest wafer stepper, the Saturn Spectrum 3, from long-time
customer Casio Computer Co., Ltd. The new tool was developed in
collaboration with this customer to meet the diverse requirements of
the flip-chip bump market, and it is the only stepper in the world
configured with the new Ultratech broadband (ghi-line) 1X optics lens.
The system is slated for immediate delivery and will augment Casio¡¯s
other existing Ultratech steppers at its Core Technology Research
Laboratory in Ome-shi, Japan.
"Considering Casio¡¯s invaluable contribution to the Saturn Spectrum 3
project, it is fitting that the first order for the advanced system
comes from this company," said Daniel Berry, Ultratech¡¯s president and
chief operating officer. "As design rules shrink, and the need for
faster, smaller and thinner packages emerges, greater emphasis is being
placed on flip-chip packaging technology. This inevitable move to the
back end has been anticipated by Ultratech for some time, and the
Saturn Spectrum 3 tool represents our latest efforts to extend low-cost
advanced front-end lithography solutions to this area. We¡¯re pleased to
count Casio as this product¡¯s first customer. Meeting their very
precise fab requirements has always been a priority for Ultratech and
we¡¯re proud to be assisting in their efforts to blaze a new trail into
back-end processing."
Commenting on the order, Yukio Kashio, executive vice president of
Casio Computer Co., Ltd., cited Ultratech¡¯s willingness to co-develop
the new broadband lens for bump applications as a critical factor in
the purchase decision. "Ultratech has a proven track record of
custom-designing their advanced lithography technology to suit
customers¡¯ precise requirements. Now, they are demonstrating their
leadership once again by providing this unique, cost-efficient tool for
bump processing applications. We appreciate their collaboration in the
development of the broadband ghi-line lens and look forward to using
their technology as we turn our attention to wafer-level, chip-size
packages."
The order for the new system marks the latest step in Casio¡¯s
successful incorporation of Ultratech¡¯s 1X wafer stepper technology
into the company¡¯s bump manufacturing process as they move away from
older contact printer technology. The Saturn Spectrum 3 builds on the
existing Ultratech systems with its unique broadband lens that allows
for automatic selection of exposure spectrum (i-line, g-line or
ghi-line).
The tool has a low numerical aperture (NA) lens design, tailored to
provide maximum depth-of-focus for bump applications, and it is
available in a variety of field sizes. Its high illumination intensity
results in high-throughput with high dose exposures, while its unique
Machine Vision System (MVS) allows for alignment to any unique feature
on the wafer.
The new stepper technology, designed specifically for bump foundry
applications, offers chipmakers greater flexibility over contact
printers and produces higher yield at lower cost, according to Berry.
"The Saturn Spectrum 3 can accommodate all wafer sizes from 4 to
8-inches and has the ability to process both thin (1 to 10 microns) and
thick (10 to 100 microns) resists on the same stepper. It is equipped
with imaging resolution down to 2.0 microns and is expected to support
all flip-chip related lithography processing requirements for the next
several years."
"Safe Harbor" Statement under the Private Securities Litigation Reform
Act of 1995: Certain of the statements contained herein may be
considered forward-looking statements that involve risks and
uncertainties, such as the cyclicality in the semiconductor and thin
film head industries, competition, lengthy sales cycles for the
company¡¯s systems, pricing pressures, the mix of products sold, delays,
deferrals and cancellations of orders by customers, manufacturing
inefficiencies and absorption levels, ability to volume-produce systems
and meet customer requirements, dependence on new product introductions
and commercial success of any new products, risks associated with
introducing new technologies, integration and development of the
UltraBeam and Verdant operations, inventor obsolescence, adjustments
relating to the potential change in accounting for the ISI acquisition,
the failure to develop and commercialize the ISI products, delays in
collecting accounts receivable, extended payment terms, economic and
political conditions in Asia and changes to technologies. Such risks
and uncertainties are set forth in the company¡¯s SEC reports, including
the company¡¯s Annual Report on Form 10-K for the period ended December
31, 1998, and its Form 10Q for the period ended June 30, 1999.
About Ultratech: Founded in 1979, Ultratech Stepper, Inc. designs,
manufactures and markets photolithography equipment used worldwide in
the fabrication of integrated circuits, micromachining devices, thin
film heads for disk drives and photomasks for the semiconductor
industry. The company produces products that substantially reduce the
cost of ownership for manufacturers in the electronics industry. The
company¡¯s home page on the World Wide Web is located at
ultratech.com .
SOURCE Ultratech Stepper, Inc.
UTEK - up a tad this Morn! |
