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To: Ian@SI who wrote (32470)	9/14/1999 4:21:00 PM
From: Proud_Infidel	Read Replies (1) \| Respond to of 70976

Winbond commits next fab to 300-mm wafer processing By Jack Robertson Semiconductor Business News (09/14/99, 10:18:16 AM EDT) HSINCHU SCIENCE PARK, Taiwan -- Winbond Electronics Corp.'s next fab -- still two years in the future -- will definitely be a 12-inch (300-mm) wafer facility, company president Chin-Chu Chang said today. "We aren't considering any more 8-inch fabs after our new Fab 5 begins production in the fourth quarter," he said in an interview here. Fab 5 will be launched with 0.175-micron processing with capability to move to 0.15-micron later, Chang said. The new fab will be used exclusively for DRAM production, with most of the chips going to Toshiba Corp. under a foundry agreement. Chang said any decision to start construction of Fab 6 must wait on 300-mm wafer technology to mature. "We're not there yet," but in two years 300-mm wafer processing should be advanced enough for Winbond to move ahead with the new fab, he added. Chip makers planning new fabs face the dilemma now of building another 8-inch wafer facility or jumping into the next-generation 300-mm wafer technology. Winbond has definitely opted to go the latter route, Chang said. semibiznews.com