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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Dan3 who wrote (72168)	9/18/1999 12:21:00 AM
From: Process Boy	Respond to of 1572777

dan - <Any advantage due to copper in MCMs may lie more in the reduction in heat dissipation than any speed increase. Remember, they used to have to water cool those things.> I concede this may be a valid point for this product group. I'm still glad Intel didn't do Cu for P858. The P3 core is going to be the flagship part for at lest the first part of the generation. I'm not really worried about the power dissipation characteristics of this design. PB

To: Dan3 who wrote (72168)	9/18/1999 12:22:00 AM
From: THE WATSONYOUTH	Read Replies (1) \| Respond to of 1572777

Re. <Performance of this 390 iteration was a major upside surprise.> Oh really. What would you expect with a more advanced groundrule generation, a better device design, and an advanced Cu BEOL? The next iteration will have even higher performance and they will both employ Cu BEOL.IBM has benefited much more from the Cu hype than from its actual performance advantage. So, it will be an advantage for AMD to have .18um Cu BEOL, but not nearly large enough change the outcome. AMD wins or loses based on architectural differences, .18um process performance (Cu BEOL being a part)and timely execution. THE WATSONYOUTH