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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Process Boy who wrote (72413)	9/20/1999 2:28:00 PM
From: Shane Geary	Respond to of 1572541

PB/Dan3 - Re"Still a puzzle to me, which is OK. I don't believe this person is totally privy to the Engineering side of this thing, but he is obviously trying to understand the factors that are determining his organization's successes and failures. Probably a good employee; team player kind of guy." Well put. From his original post, it's obvious he doesn't know anything about lithography: "I am not sure we will ever reach .13 with the current litho technology. We are probably going to have to change to xray litho tech to get that low. I have however seen post in tech mags that say it is possible with current tech. used at U of T. " Thus he's not at the integration engineer level with wide experience and understanding of the process. So take what he says with a pinch of salt. He appears to work in the etch area, but even his knowledge of this is incorrect: "65% of production time is spent in etch". Another error: "difussion furnace 500 wafers per run" Like PB, I have trouble believing that AMD had a problem that limited yield to 3% and went on for 'months', especially since it was a physical process issue like open contacts. You test the SRAM to locate the exact bit that failed, FIB it and find your defect. Months??? I think he is confused about how local interconnect is integrated into a backend process. Still, everything he says has a ring of truth about it - the problems he described are recognisable in some form, even if he doesn't quite know the magnitude and technical details. I'd guess at technician or operator level, not engineering. Hope he keeps posting (and Dan keeps posting it here). Regards, Shane