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Technology Stocks : Rambus (RMBS) - Eagle or Penguin -- Ignore unavailable to you. Want to Upgrade?

To: richard surckla who wrote (30049)	9/21/1999 1:53:00 AM
From: Dave B	Read Replies (1) \| Respond to of 93625

Thought I'd get an early jump on tracking the RDRAM-based systems that have been announced (I'll try to keep it updated): Mfg Model Memory Date Ann'd Price System Type Comments HP VL600 RDRAM 9/20/99 $ Corporate (Managed) HP XM600 RDRAM/SDRAM 9/20/99 $ PC Workstation Dual-processor capable HP XM800 RDRAM/SDRAM 9/20/99 $ PC Workstation Dual-processor capable Dell GX200 RDRAM 8/27/99 $ Corporate (Managed) Accidentally ann'd Dell GX300 RDRAM 8/27/99 $ Corporate (Managed) Accidentally ann'd Feel free to make suggestions on how to improve the list ("make it longer" I already have in the suggestion box, thanks <G>). Dave

To: richard surckla who wrote (30049)	9/21/1999 2:02:00 AM
From: richard surckla	Read Replies (1) \| Respond to of 93625

From Techbuyer post on Yahoo... Another Rambus patent..... 164.195.100.11 /search-bool.html&r=1&f=G&l=50&co1=OR&d=curr&s1=Rambus&s2=Rdram&OS=Rambus+OR+Rdr am&RS=Rambus+OR+Rdram CLIP: The present invention includes a memory subsystem comprising at least two semiconductor devices, including at least one memory device, connected to a bus, where the bus includes a plurality of bus lines for carrying substantially all address, data and control information needed by said memory devices, where the control information includes device-select information and the bus has substantially fewer bus lines than the number of bits in a single address, and the bus carries device-select information without the need for separate device-select lines connected directly to individual devices. CLIP: An integrated circuit bus interface for computer and video systems is described which allows high speed transfer of blocks of data, particularly to and from memory devices, with reduced power consumption and increased system reliability. A new method of physically implementing the bus architecture is also described. CLIP: A primary result of the architecture of this invention is to increase the bandwidth of DRAM access. The invention also reduces manufacturing and production costs, power consumption, and increases packing density and system reliability.