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Technology Stocks : Lam Research (LRCX, NASDAQ): To the Insiders -- Ignore unavailable to you. Want to Upgrade?

To: Jong Hyun Yoo who wrote (3355)	9/21/1999 8:11:00 PM
From: Proud_Infidel	Read Replies (1) \| Respond to of 5867

JHY, Thanks for the report. The numbers seem a bit conservative though, I agree. And doesn't STI stand for shallow trench isolation, not silicon trench isolation (STI) ? I am by no means an expert, but I've spent years trying to learn these acronyms:-)))) BK

To: Jong Hyun Yoo who wrote (3355)	9/22/1999 9:31:00 AM
From: Kevin J. Koons	Respond to of 5867

Do not understand why any brokerage firm would issue a report like this one. This one is a waste of time.

To: Jong Hyun Yoo who wrote (3355)	10/11/2001 7:12:54 PM
From: Proud_Infidel	Respond to of 5867

Tegal says new patent adds another barrier for etch competitors Semiconductor Business News (10/11/01 08:47 a.m. EST) PETALUMA, Calif. -- Plasma-etch systems supplier Tegal Corp. today announced it has received a key U.S. patent for controlling the critical dimensions of devices during the etching process in sub-0.13-micron technologies. Tegal said the new patent (No. 6,287,975) covers a novel method, which exploits a masking material's natural properties while enabling the etching of the unique materials associated with the production of next-generation microprocessors, DRAMs, magnetic RAMs, ferroelectric memories, thin-film heads, compound semiconductors, and complex system-on-chip designs. The new patent could become another legal weapon in Tegal's portfolio of next-generation etch technologies. In the past couple of years, the Petaluma-based company has filed patent infringement suits against larger competitors--Tokyo Electron Ltd. (TEL) and Lam Research Corp.--claiming infringement of its dual-frequency etch patent. Earlier this year, Tegal received an undisclosed amount of money from Applied Materials Inc. for a non-exclusive license of the dual-frequency technology (see Jan. 2 story). The new '975 patent "enables the active management of the material transport processes that effect the final profile and critical dimensions on devices during etch," said Steve DeOrnellas, chief technical officer and vice president of Tegal. "By using the method of the '975 patent our customers can develop the robust next-generation processes required for a broad array of next generation of device types. "We also believe this patent strengthens Tegal's position in its chosen markets and represents a barrier to others attempting to use these materials to manufacture many different types of devices," he warned. To protect the technology worldwide, Tegal has filed the '975 patent globally under the Patent Cooperation Treaty, said Mike Parodi, chairman, president and CEO of the company.