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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Yousef who wrote (73139)	9/26/1999 9:01:00 PM
From: Bill Jackson	Respond to of 1571591

Yousef, I get the picture, the copper gets carried over to the next stage where it is a contaminant as it diffuses into the Si and give you a funny compound that does not work at that stage. They would have to scour the Si surface with an ultrasound with heavy density grits that will nudge the copper contaminants into motion from the settled/stuck spots ont the Si. Copper may well stick tight due to the rubbing process so some aggrssive means must be needed to remove it. Light grit may not move it as the grits will not transfer monentum the the copper unless they are about the same size as well as denser. Light stuff will bounce off?? tungsten carbide super fine dust might do it, it is dense and tough, What collateral damage trouble with the dust do? beats me? if any. I expect they have a procedure and ritual to follow that Motorola has made work, they just have to do it and monitor the surface as they go....how do they know when they have any copper on the surface before they go to the next step? Bill Bill