To: John Rieman who wrote (45426 ) 9/26/1999 1:17:00 PM From: JPM Respond to of 50808
Hsinchu, Taiwan, September 26, 1999 V Taiwan Semiconductor Manufacturing Company (TSMC or the "Company") (NYSE: TSM) indicated that as of 17:30 p.m. today 50 percent of the Company's wafer process equipment has already been released for production as a result of the stable power supply by the Taipower and the complete dedication of TSMC's employees. Meanwhile, TSMC has already shipped some finished goods to its customers with the restored capacity. (READ: TSM has shipped to CUBE the shippment which was 'in the truck' when the quake hit.) TSMC spokesman, YC Huang stated that this morning a magnitude 6.7 aftershock hit the central part of Taiwan again. Fortunately, this aftershock did not have any effect on the Company's recovering progress since the aftershock only measured 3 to 4 in the Hsin-Chu Science-Based Park. Followed by yesterday's 20 percent recovery, half of the Company's wafer production equipment has recovered. Mr. Huang continued, "At press time, the wafer moves of our two 6-inch fabs (Fab 1 and Fab 2) are faster and have reached 40 percent. The wafer moves of these two fabs are expected to reach 80 percent on September 28th, 1999. On the other hand, our other three 8-inch fabs (Fab 3, Fab4, and Fab5) have already seen a 15 percent wafer moves, and the figure is expected to return to 70 to 80 percent no later than September 30th, 1999." "Since September 24th,1999, on which day TSMC's received 60 percent power supply from Taipower, we have been working very hard for production recovery to continue processing survived wafers. From this point on, we expect to have continuously increasing shipment. However, it takes time to recover to the normal output. We will try our very best to achieve this goal as soon as possible," Mr. Huang said.