To: greenspirit who wrote (88978 ) 9/27/1999 10:22:00 AM From: Burt Masnick Read Replies (2) | Respond to of 186894
Latest as of 9:04 EST on Rambus, Camino. Rambus Confirms Delays In Intel 820 Chips Filed at 9:04 a.m. EDT By Reuters MOUNTAIN VIEW, Calif. (Reuters) - Rambus Inc. Monday said it is working to resolve several bugs with Intel Corp. and leading personal computer makers on upcoming Intel computer memory chips using Rambus technology. In a statement, Rambus said that ''some issues'' have been identified in testing of three modules of Rambus-based computer memory that are part of the highly anticipated, but already behind schedule, Intel 820 chipset, code-named Camino. Speculation that Rambus was having trouble making its technology work with the new Intel chips had contributed to a sharp decline in Rambus shares Friday, as the stock lost more than 15 to close at 71-1/8. In pre-open trading Monday, the stock fell another nearly 8 to 63-1/2. Analysts also cited concern over a recent uptick in overall memory prices as another factor that could hurt Rambus stock. In a further blow Monday, Morgan Stanley Dean Witter cut its rating on Rambus to outperform from strong buy. Rambus said it continues to work on testing personal computer compatibility of its memory technology with Intel and personal computer makers such as Dell Computer Corp., the world's No. 2 personal computer maker, and Toshiba Corp., the leading notebook PC maker. Executives from Intel and the PC makers were quoted as saying they were committed to continuing to work with Rambus. An Intel spokesman stressed that the issues were related to implentation of the technology in specific computer designs, not with the Intel chips themselves. ''Some issues with platforms supporting three RIMM module connectors have been identified, and Intel, Rambus and the OEMs are working to quickly resolve them,'' Rambus said in the statement. RIMM refers to a type of Rambus-based computer memory chip. OEMs are PC makers. ''The testing has shown that some configurations have issues relating to the combination of the memory system components, module configurations, and motherboard design,'' the company said.