Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : AMD/INTC/RMBS et ALL -- Ignore unavailable to you. Want to Upgrade?

To: Bilow who wrote (136)	9/28/1999 4:11:00 AM
From: Bilow	Read Replies (1) \| Respond to of 271

Another likely future competitor both to embedded DRAM and Rambus, is stacked chips. In this technology, different chips are stacked together. With respect to DRAM, this allows the logic chips to have a different process than the memory chips. It also allows for larger pinouts on the memory chip, thereby increasing bandwidth, but without increasing PCB routing. Sharp Stacks Chips In System Integration offer the three-chip stacked CSP at a price similar to three single CSPs... volume production in August. 200-pin package with an 0.8-mm pitch as its first offering. techweb.com techweb.com Paper-thin pack may bend limits for mobile gear A maximum of eight chips can be stacked using the new package; such a configuration would measure roughly 1 mm in height. Toshiba plans to sample a 1-Gbit SmartMedia card with four 256-Mbit flash chips in next year's first half. techweb.com Intel, Hitachi join Sharp's stacked chip-scale group The standard includes 64-pin and 72-pin specifications, each with pin pitch of 0.8 mm. techweb.com -- Carl

To: Bilow who wrote (136)	9/28/1999 10:09:00 AM
From: grok	Read Replies (1) \| Respond to of 271

RE: <They will require underclocking of the RDRAM. Even now, I'll bet they have tried this and it worked for them, they just don't want to give the performance hit, especially when the technology gives so few benefits already.> I've heard that Dell's problems were at 700 MHz. Can 600 MHz be far away? I suppose that all the testing at Dell was done with Rdrams from the same vendor, probably Samsung. I wonder what happens when the day comes that people start adding memory in the field with RIMMs from various vendors?