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To: ekn who wrote (15921)	10/5/1999 9:31:00 AM
From: ekn	Read Replies (2) \| Respond to of 52051

IRSN NEWS*** Irvine Sensors Receives Patent For Neo-Stack; Allows Different Chips to Be Stacked Together for Embedded Systems COSTA MESA, Calif., Oct. 5 /PRNewswire/ -- Irvine Sensors Corporation (Nasdaq: IRSN - news; Boston: ISC - news), today announced receipt of U.S. Patent Number 5,953,588 on its Neo-Stack(TM) technology which permits different size and function microelectronics to be stacked and integrated in an extremely miniaturized unit. Key to the Neo-stacking process, presently under development by Irvine Sensors, is the ability to mount precisely-aligned, known-good chips of varying types on a single mounting layer...in effect, reconstructing the equivalent of a semiconductor wafer, but from diverse sources. After subsequent processing at this ''wafer'' level, the overall structure can be diced into its constituent, common-sized ''frames'' which can then be stacked into an integrated, 3-dimensional assembly. The resulting unit is an ultra-high-density, embeddable system. The process is not limited to conventional integrated circuit chips, but can be also be used with advanced technologies such as high-speed Gallium Arsenide circuitry as well as miniaturized optical, opto-electronic and electromechanical sensors...all ''mixed and matched'' within the same stack. ''People have talked about 'systems-on-a-chip' for years. But, there are limits to what can be achieved in two dimensions. The input-output bottleneck as chips grow larger is particularly challenging. The internal interconnects we can achieve within a Neo-stack breaks this bottleneck,'' said John C. Carson, Irvine Sensors' Sr. Vice President and Chief Technical Officer. ''We believe these kinds of problems plus the insatiable demand for greater electronic miniaturization are creating a need for 'systems-in-a-cube.' Achievement of this goal could also hasten the demise of printed circuit boards as we currently know them. The Neo-stack patent award demonstrates our technological leadership in this area and underpins our planned product roadmap for years to come,'' Carson concluded. Irvine Sensors expects to fully demonstrate the capabilities of the Neo- stacking technology via several current development programs. A stackable neo-layer of several different chips including lasers and detectors has already been functionally demonstrated under a U.S. Army program to develop opto-electronic switches and processing modules. ''Smart memory'' sub-systems, such as those required for the company's Silicon Brain program, are also an application for Neo-stacks. The Fast Readout Optical Storage (FROST) development program, announced earlier this year, is employing Neo-stacking to develop a high-speed, removable optical storage system for future generation DVD systems. Irvine Sensors Corporation, headquartered in Costa Mesa, California, is primarily engaged in the development and sale of high density electronics, MicroElectroMechanical sensors (MEMS), sensor readout circuits, miniature cameras, high density interconnections, photonics communication, image processing and recognition devices, electronic image stabilization, wireless infrared communications products, and low-power analog and mixed-signal integrated circuits for diverse systems applications. Except for historical information contained herein, the matters set forth in this news release are forward-looking statements that are dependent on risks and uncertainties including such factors, among others, as the market risks associated with new products, the impact of competitive technologies and the pace at which new markets develop. Further information on Irvine Sensors Corporation is contained in publicly-filed disclosures available through the SEC's EDGAR database (www.sec.gov) or from the Company's Investor Relations. SOURCE: Irvine Sensors Corporation