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To: grok who wrote (31209)9/30/1999 12:32:00 AM
From: Bilow  Read Replies (2) | Respond to of 93625
 
Hi KZNerd; Something like MCM. There are just a little too many product announcements, right now, to ignore it.

The thing that is really significant is bump chip I/O technology. Whereas wire bonding requires a certain cost per wire, bump chip I/Os only cost a certain amount per wafer. The technology allows unprecedented numbers of cheap I/O, and a whole bunch of engineers are going to be sitting around trying to figure out what to do with it... They certainly don't want to route it around on a PCB.

I've been saying for years that the evolution of the PC is inevitably to a single chip device, and that this would happen by 2004 or so. But MCM could bring it here somewhat earlier. Samples of some pretty interesting stuff is already available. I think that the big guys are preparing to push this technology big time.

System on Chip...

The drive is cost, weight, performance, power consumption. The target is the $100 PC with much higher performance than anything currently available. A lot of technology is going to become obsolete along the way.

-- Carl