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To: Bilow who wrote (31214)9/30/1999 12:59:00 AM
From: dmf  Read Replies (1) | Respond to of 93625
 
Bilow: I understand the reasons for not always revealing your full name. Would you consider explaining your position in the industry, so we could understand your perspective better? Sorry if I've missed this from previous posts.

Thanks, dmf



To: Bilow who wrote (31214)9/30/1999 6:25:00 PM
From: George the Greek  Read Replies (1) | Respond to of 93625
 
Carl, I found your postings on bump-chip packaging tech
bringing about intermediate-term
obsolescence of PCB interconnect
very interesting,
but haven't had the time to dig into it.

Quick question: is bump-chip like BGA,
excecpt that it is die-to-die interconnect,
rather than chip-package-to-PCB interconnect?

George


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