To: Sridhar Srinivasan who wrote (48792 ) 9/30/1999 8:51:00 AM From: yousef hashmi Respond to of 53903
-- =DJ Taiwan Chip Cos Bounce Back, But Quake Ripples To Linger -- NEW YORK (Dow Jones)--Taiwan's semiconductor manufacturers are recovering from last week's earthquake, but its effects could linger until the first quarter of 2000, analysts said. The recovery is "pretty much meeting our expectations," said Mark Edelstone, a chip analyst at Morgan Stanley Dean Witter. "It's better than some of the panic that was impacting the sector last week (when investors were) coming to conclusions that were far too negative." UMC Group and Taiwan Semiconductor Manufacturing Co. (TSM) will probably weather manufacturing interruptions of 11 or 12 days; their factories are running at between 50 and 75% capacity right now, analysts said. And these companies reported little serious equipment damage, said Jay Deahna, Morgan Stanley's chip equipment analyst. Deahna and Edelstone held a conference call Wednesday to discuss the earthquake's impact on chip companies. Edelstone said the earthquake probably won't prevent chip companies from meeting analysts' third-quarter estimates, although it could "limit upside." Analysts said they expect lean inventory in the fourth quarter, which could keep a lid on revenue in the period. Shortages may not be a problem because some companies were building inventory to prepare for any year 2000-related glitches. But those lean inventories could actually cushion the normal falloff in demand in the first quarter, said Charlie Glavin, an analyst at Credit Suisse First Boston. "We're talking about the first quarter being more robust" than is usual in the period, Glavin said. Glavin said several stocks were oversold during last week's earthquake jitters, including Broadcom Corp. (BRCM) and PMC Sierra Inc. (PMCS). - Christopher Grimes, Dow Jones Newswires, 201-938-5253 (END) DOW JONES NEWS 09-29-99 03:54 PM- - 03 54 PM EDT 09-29-99 Symbols: US;BRCM US;PMCS TW;2330 US;TSM Source DJ - Dow Jones Categories: I/SEM SUB/DJN N/DJN SUB/DJWI N/DJWI SUB/ADR N/ADR SUB/DJS N/DJS SUB/WEI N/WEI SUB/Y2K N/Y2K M/TEC P/DAA P/DCO P/DSE GEO/ASI R/ASI GEO/CAL R/CAL GEO/FE R/FE GEO/NME R/NME GEO/PRM R/PRM GEO/TW R/TW GEO/US R/US GEO/USW R/USW