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To: ekn who wrote (101703)	10/5/1999 10:24:00 AM
From: GBT	Respond to of 119973

IRSN patent looks pretty sweet. IRSN NEWS*****> Irvine Sensors Receives Patent For Neo-Stack; Allows Different Chips to Be Stacked Together for Embedded Systems COSTA MESA, Calif., Oct. 5 /PRNewswire/ -- Irvine Sensors Corporation (Nasdaq: IRSN - news; Boston: ISC - news), today announced receipt of U.S. Patent Number 5,953,588 on its Neo-Stack(TM) technology which permits different size and function microelectronics to be stacked and integrated in an extremely miniaturized unit. Key to the Neo-stacking process, presently under development by Irvine Sensors, is the ability to mount precisely-aligned, known-good chips of varying types on a single mounting layer...in effect, reconstructing the equivalent of a semiconductor wafer, but from diverse sources. After subsequent processing at this ''wafer'' level, the overall structure can be diced into its constituent, common-sized ''frames'' which can then be stacked into an integrated, 3-dimensional assembly. The resulting unit is an ultra-high-density, embeddable system. The process is not limited to conventional integrated circuit chips, but can be also be used with advanced technologies such as high-speed Gallium Arsenide circuitry as well as miniaturized optical, opto-electronic and electromechanical sensors...all ''mixed and matched'' within the same stackm ''People have talked about 'systems-on-a-chip' for years. But, there are limits to what can be achieved in two dimensions. The input-output bottleneck as chips grow larger is particularly challenging. The internal interconnects we can achieve within a Neo-stack breaks this bottleneck,'' said John C. Carson, Irvine Sensors' Sr. Vice President and Chief Technical Officer. ''We believe these kinds of problems plus the insatiable demand for greater electronic miniaturization are creating a need for 'systems-in-a-cube.' Achievement of this goal could also hasten the demise of printed circuit boards as we currently know them. The Neo-stack patent award demonstrates our technological leadership in this area and underpins our planned product roadmap for years to come,'' Carson concluded.