SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?


To: kash johal who wrote (75290)10/13/1999 7:30:00 AM
From: Bill Jackson  Respond to of 1573891
 
kash, Well cheeze does penetrate well and is a good thermal conductor.
I can see packaging to be a problem. Let us see a package with pins on both sides that can be made separately(and tested) and then placed face to face with a structure between them, like a zebra strip in concept but with single line conductors, call it a leopard pad that when compressed between two chips would connect pads together electrically to allow a close in memory bus of some size to be close to the cpu? There could also be a scaffold with conductors ending in bump contacts to bridge the gap?

Bill