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Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?

To: Proud_Infidel who wrote (32804)	10/13/1999 10:59:00 AM
From: Proud_Infidel	Respond to of 70976

UMC Group moves equipment into new fab ahead of schedule Semiconductor Business News (10/13/99, 09:13:06 AM EDT) HSINCHU, Taiwan -- UMC Group said here today that it has begun moving the first pieces of production equipment at its new 8-inch wafer fab in the Hsinchu Science-based Industrial Park, and is ahead of schedule. Trial production is expected to begin in December. Fab 8F (formerly called UMC Fab 5), is the first of two new UMC Group fabs scheduled for volume production in 2000, UMC said. The second, Fab 8C (formerly called USC 2), will begin trial production at the end of the first quarter of 2000. In light of the recent earthquake in Taiwan, completing cleanroom installation two weeks ahead of an already accelerated schedule "is a remarkable accomplishment," said Chris Chi, senior vice president in charge of operations at Fab 8F. "The fact that none of the UMC Group fabs suffered any significant structural damage is a testimony to the quality of fab construction techniques in Taiwan," Chi said. "With this new fab, UMC Group will be better positioned to respond to the strong demand we are currently experiencing for our advanced process technologies." UMC Group claimed it will be the largest foundry supplier of 0.25- and 0.18-micron technology, shipping 1.2 million wafers with those geometries. With the addition of the two new fabs, UMC Group will operate a total of seven 8-inch wafer fabs. Fab 8F has a design capacity of 40,000 wafers per month, and will exceed monthly production of 20,000 wafers by the end of 2000. It will ramp production starting with UMC Group's 0.18-micron logic process, and eventually support 0.15- and 0.13-micron process technology. semibiznews.com