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To: Jeffrey D who wrote (32811)	10/14/1999 12:27:00 AM
From: Gottfried	Respond to of 70976

Jeffrey, thanks for the article! Morgan, a mere youngster, is astute enough to select a worthy successor - should that become necessary. First, let's get to $12B. :0) G.

To: Jeffrey D who wrote (32811)	10/14/1999 6:53:00 PM
From: Proud_Infidel	Read Replies (1) \| Respond to of 70976

Hyundai Microelectronics to debut in 2000 with aggressive production schedule By Jack Robertson Electronic Buyers' News (10/14/99, 01:49:44 PM EDT) Hyundai Microelectronics Co. Ltd., the newly created semiconductor concern borne of the merger of Hyundai Electronics Industries Co. Ltd. and LG Semicon Co. Ltd. will be spun out officially in the first half of 2000, the company said today. Farhad Tabrizi, director of worldwide marketing for Hyundai Electronics America, San Jose, said the new chip company is expected to generate revenue of $6.5 billion next year and $8 billion in 2001, up from between $4 billion and $4.5 billion this year. Tabrizi said the new group is now producing at the rate of 300,000 wafer starts a month in nine 8-in. and two 6-in. fabs, and includes what Hyundai now claims to be the industry's highest-volume DRAM production operation. The Hyundai chip group is producing 64-Mbit DRAM at the rate of 45 million units a month, he said. The company has slowed down its ramp of 128-Mbit SDRAM, "because the same production line can make 64-Mbit SDRAMs more profitably," Tabrizi said. Hyundai plans to spend $500 million in new semiconductor capital this year to upgrade existing fabs within the merged operation, and while a 2000 budget has not been set, the company could spent more than $1 billion the following year, according to Tabrizi. Hyundai will decide next year whether to start equipping one of its two fab shells in the United Kingdom. Both Hyundai's shell in Scotland and the former LG shell in Wales are clean room ready, the company said. Tabrizi said one of the sites might be used for chip testing or other back-end fab activity. Hyundai's upgrade plan should allow 200,000 of the company's total 300,000 monthly wafer starts to be manufactured using process design rules of 0.22 microns or lower by the end of the year. The company is ramping up its 0.18-micron process and expects in the third quarter of 2000 to have the majority of wafer starts at this level. The upgrade includes former LG fabs, which have generally trailed Hyundai in sub-0.25-micron processing. The former LG Fab 7 in Chongju, Korea, is now capable of 50,000 wafer starts a month on a 0.18-micron process, the company said