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Technology Stocks : WDC/Sandisk Corporation -- Ignore unavailable to you. Want to Upgrade?

To: Binx Bolling who wrote (7717)	10/16/1999 7:46:00 AM
From: Ausdauer	Read Replies (1) \| Respond to of 60323

Binx, 5,602,987 Flash EEprom system A system of Flash EEprom memory chips with controlling circuits serves as non-volatile memory such as that provided by magnetic disk drives. Improvements include selective multiple sector erase, in which any combinations of Flash sectors may be erased together. Selective sectors among the selected combination may also be de-selected during the erase operation. Another improvement is the ability to remap and replace defective cells with substitute cells. The remapping is performed automatically as soon as a defective cell is detected. When the number of defects in a Flash sector becomes large, the whole sector is remapped. Yet another improvement is the use of a write cache to reduce the number of writes to the Flash EEprom memory, thereby minimizing the stress to the device from undergoing too many write/erase cycling. 5,268,870 Flash EEPROM system and intelligent programming and erasing methods therefor A memory system made up of electrically programmable read only memory (EPROM) or flash electrically erasable and programmable read only memory (EEPROM) cells. An intelligent programming technique allows each memory cell to store more than the usual one bit of information. An intelligent erase algorithm prolongs the useful life of the memory cells. Individual records of the number of erase cycles experienced by blocks of flash EEPROM cells are kept, preferably as part of the blocks themselves, in order to maintain an endurance history of the cells within the blocks. A series of pulses of increasing voltage is applied during programming and erasing of the array. During erasing, specified cells within a block of cells being erased are read in-between the pulses, and the process is stopped when the specified cells are read to have reached a desired state or a maximum number of pulses is reached. The entire block is then read to determine the number of cells that have not been completely erased. The unerased cells are replaced by redundant cells unless there are too many unerased cells, in which case a flag is generated to indicate that the array may have reached its endurance limit. Use of these various features provides a memory having a very high storage density and a long life, making it particularly useful as a solid state memory in place of magnetic disk storage devices in computer systems. 5,172,338 Multi-state EEprom read and write circuits and techniques Improvements in the circuits and techniques for read, write and erase of EEprom memory enable non-volatile multi-state memory to operate with enhanced performance over an extended period of time. In the improved circuits for normal read, and read between write or erase for verification, the reading is made relative to a set of threshold levels as provided by a corresponding set of reference cells which closely track and make adjustment for the variations presented by the memory cells. In one embodiment, each Flash sector of memory cells has its own reference cells for reading the cells in the sector, and a set of reference cells also exists for the whole memory chip acting as a master reference. In another embodiment, the reading is made relative to a set of threshold levels simultaneously by means of a one-to-many current mirror circuit. In improved write or erase circuits, verification of the written or erased data is done in parallel on a group of memory cells at a time and a circuit selectively inhibits further write or erase to those cells which have been correctly verified. Other improvements includes programming the ground state after erase, independent and variable power supply for the control gate of EEprom memory cells. 5,070,032 Method of making dense flash EEprom semiconductor memory structures An improved electrically erasable and programmable read only memory (EEprom) structure and processes of making it which results in a denser integrated circuit, improved operation and extended lifetime. In order to eliminate certain ill effects resulting from tolerances which must be allowed for registration of masks used in successive steps in forming the semiconductor structures, spacers are formed with reference to the position of existing elements in order to form floating gates and define small areas of these gates where, in a controlled fashion, a tunnel erase dielectric is formed. Alternatively, a polysilicon strip conductor is separated into separate control gates by a series of etching steps that includes an anisotropic etch of boundary oxide layers to define the area of the control gates that are coupled to the erase gate through an erase dielectric. In either case, the polysilicon layer strip can alternatively be separated by growing oxide thereon until it is completely consumed. A technique for forming a pure oxide dielectric layer of uniform thickness includes depositing a thin layer of an undoped polysilicon material and then oxidizing its surface until substantially the entire undoped polysilicon layer is consumed and made part of the resulting oxide layer. Overlapping doped regions are provided in the substrate by an ion implantation mask that adds spacers to the mask aperture to change its size between implants. Ausdauer SanDisk...See the Big Picture.