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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Charles R who wrote (75823)10/18/1999 1:09:00 AM
From: Elmer  Respond to of 1571699
 
Re: "CuMine uses extra layer of metal for local interconnect"

I believe this statement is an oxymoron.

EP



To: Charles R who wrote (75823)10/18/1999 1:17:00 AM
From: Process Boy  Read Replies (1) | Respond to of 1571699
 
Charles - <On the positive side - CuMine uses extra layer of metal for local interconnect and layout guys seem to have taken care of some of the critical RC paths to help the ramp.>

This is incorrect.

K7/AMD uses local interconnect technology, Intel does not (thank Goodness). The K7 currently has seven layers of interconnect counting M0 (local interconnect) on its .25 backend process. P856 (.25) has 5 layers of interconnect. P858 (.18) has 6 layers of interconnect.

PB




To: Charles R who wrote (75823)10/18/1999 1:58:00 AM
From: Paul Engel  Read Replies (1) | Respond to of 1571699
 
Chuckles - Re: "- CuMine uses extra layer of metal for local interconnect and layout guys seem to have taken care of some of the critical RC paths to help the ramp."

Intel uses 6 layers of Metal for the Coppermine but DOES NOT USE ANY LOCAL INTERCONNECT LAYERS.

Paul


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