jdassoc: John, what am I reading? Is this of any significance?
BW0846 OCT 18,1999 17:00 PACIFIC 20:00 EASTERN
( BW)(CA-TESSERA) Tessera and LG Electronics Announce Technology
Agreement; Firms to Partner on Development, Manufacturing and Marketing
of Two-Metal Substrate for Chip Scale Packaging Technology
Business Editors/High-Tech Writers
SAN JOSE, Calif.--(BUSINESS WIRE)--Oct. 18, 1999--Tessera, Inc. and LG Electronics Inc.
PCB OBU today announced that they have signed a technology agreement that will ultimately enable
broad availability of low-cost, two-metal substrate for chip scale packages.
Tessera's uBGA(R) technology has been accepted as the de facto standard for a number of
memory architectures, including Flash and Rambus RDRAM. The ultimate objective of the
partnership is to develop and expand the market for chip scale packaging technology into high pin
count, high-performance applications such as ASIC and DSP.
The partnership recognizes and leverages the relative strengths of the two companies: Tessera as a
leading developer and marketer of innovative chip scale packaging technology, and LG Electronics
PCB OBU as a leading substrate manufacturer. According to the terms of the agreement, LG
Electronics PCB OBU will operate Tessera's two-metal substrate organization in San Jose as an
R&D center, and prototype and pilot production line.
Both companies will supply resources to staff the operation, and employees will remain part of their
respective companies. The objective is to transfer the developed process to LG Electronics PCB
OBU's Korean facility for high-volume production and continued cost reduction. Tessera has also
agreed to provide design, marketing and sales support to launch and accelerate the adoption of
two-metal tape into the semiconductor assembly infrastructure.
"We view this partnership as critical to the adoption of Tessera's advanced chip scale packaging
technology for a broad range of applications," said Bruce McWilliams, Tessera's president and chief
executive officer. "With LG Electronics as manufacturing partner for two-metal substrate, we will
continue to provide the industry with chip scale technology that enables ever smaller, faster and
lower-cost semiconductor devices that utilize a standard and compatible package and assembly
infrastructure."
"The partnership with Tessera, coupled with our existing production capability, will enable an
accelerated ramp of advanced substrates, providing our customers with a single source for package
substrates over a broad range of applications," said Harry J. Ha, vice president of LG Electronics Inc.
PCB OBU. "Ultimately, the entire industry will benefit as chip scale packaging enables products such
as cellular phones, computers and Internet access devices to provide more features with higher
performance in ever smaller form factors."
About Tessera
Tessera is the leading provider and licenser of Chip Scale Packaging technology to the
semiconductor industry. The company's technology enables the industry to deliver semiconductor
devices optimized for performance, reliability, size and cost. Tessera's uBGA(R) package technology
has been adopted as the de facto standard for a number of memory architectures, with over 250
companies supporting the package with materials, equipment and test solutions.
Tessera currently licenses its advanced packaging technology to over 30 assembly and
semiconductor companies, including Amkor, ASE, AMD, ChipMOS, ChipPAC, EEMS, Hitachi,
Hyundai, Infineon, Intel, IPAC, LG, Mitsui, Samsung, Sharp, Shinko, Sony, SPIL, ST
Microelectronics, Texas Instruments and Toshiba. Tessera is based in San Jose, Calif. For more
information, visit www.tessera.com.
About LG Electronics PCB OBU
Based on the corporate philosophy of creating value for customers, LG Electronics PCB OBU
(Operating Business Unit) has grown to be one of the top-class PCB suppliers. To support the
multi-media and telecommunication industries, PCB OBU has accumulated advanced mass
production technology in the areas of Single-sided, Multi-layer Board, Ball Grid Array, and Chip
Scale Package substrates. In addition, through the certification of ISO 9002 the PCB OBU has laid
the foundation for a systematic quality assurance system and has been improving its reliability for
customer satisfaction. For more information, visit pcb.co.kr.
Note to Editors: Tessera and uBGA are registered trademarks and WAVE is a trademark of
Tessera Inc. All other brand and product names may be trademarks of their respective companies.
The "u" in the package technology "uBGA" mentioned above should be the Greek letter "mu,"
standing for micro.
--30--pw/sf*
CONTACT: The Hoffman Agency for Tessera
Paul Barbieri, 408/286-2611
pbarbieri@hoffman.com
or
PCB OBU, LG Electronics Inc., Korea
Yongil Kim Ph.D., 82-339-3701-345
yikim@lge.co.kr
KEYWORD: CALIFORNIA INTERNATIONAL ASIA PACIFIC
INDUSTRY KEYWORD: COMPUTERS/ELECTRONICS HARDWARE
MARKETING AGREEMENT |
