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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Petz who wrote (76976)	10/25/1999 11:18:00 PM
From: Tenchusatsu	Read Replies (2) \| Respond to of 1577228

Petz, you already know how I feel about Tom Pabst these days, so I won't comment on his benchmarks. I will, however, show you what Anand found: anandtech.com Here, Camino clearly beats VIA's chipset in 3D Studio MAX by 11%. And the VIA chipset was even using PC133 VC-SDRAM. As usual, I'm a fair guy, so I feel obligated to say that VIA's chipset did win in some benchmarks, but only by a small amount. The 820 won in other benchmarks, but once again only by a small amount, with the exception of the nice performance improvement in 3D Studio MAX. Tenchusatsu

To: Petz who wrote (76976)	10/25/1999 11:39:00 PM
From: Goutam	Read Replies (2) \| Respond to of 1577228

Petz, [... 1 ...]    Other than the lower pin count advantage when compared to DDR, everything else seems to be a negative with RAMBUS - bigger die size, complex testing, heat issues, etc. Here is an article about the risks being faced by the thermal solution providers. It seems, the i820 fiasco affected the thermal solution providers too! Rambus in the Hot Seat electronicnews.com _________ San JoseWith the latest delay of the Camino chipset, the heat is off for Rambus DRAM (RDRAM). However, in a literal sense, RDRAM remains red hot. So said passives firms attending the Wescon/99 trade show here last week as they prepared for the significant thermal challenges presented by the next-generation memory technology. The Camino delay has thrown the timetable of Rambus into question. Reflecting that, Rambus Inc. and Intel Corp., which formerly were extremely bullish in their predictions for the technology's future, have gone silent on the memory's progress. "Rambus and Intel have gotten extremely quiet on this," noted DRAM watcher Jim Handy of the market research firm Gartner Group/Dataquest. Because of this, many thermal management firms have Rambus-optimized solutions ready to go, but no where to sell them. Balancing significant cost implications with ready availability, concerns still linger as to the technology's potential thermal problems, which are still an unknown quantity. Such variables leave some to question whether Rambus can perform as it has promised. And an abstract set of guidelines released by Rambus concerning thermal materials has only served to throw more darkness on a situation which, many feel, needs to start shedding some light. ... More ... electronicnews.com _____________________ [... 2 ...]    In contrast to RAMBUS, check this brief report about higher density DDR DIMMs! SiliconTech rolls stacked DDR SDRAM components electronicnews.com ___________________ Oct 21, 1999 --- Adjunct Advanced Memory International (AMI2) member and memory module maker SiliconTech Inc. has made Double Data Rate (DDR) SDRAM stacked components available. The high-density DDR SDRAM MonoStack components come in 128, 256 and 512 Megabit densities. SiliconTech's MonoStack components consist of two standard DDR SDRAM TSOPs stacked together within the footprint of a single DDR SDRAM component. The stacked component allows for higher memory module densities that can be "drop-in" replacements for existing low-density memory components. The pins on the stacked components match the assignment of the comparable density monolithic components and do not require any modification or changes to lead formation. The TSOPs are separated from each other with an air gap that acts as thermal insulation preventing the upper chip from dissipating heat to the lower chip. __________________________________________ [... 3 ...]    Go here silicontech.com to see a picture of a stacked dimm. Regards, Goutama