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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Elmer who wrote (77761)	10/29/1999 2:15:00 PM
From: Bill Jackson	Respond to of 1572893

Elmer, What you say it quite true, they will add features as they shrink and this will indeed stabilize the rate of decrease of die size. Still getting close to the limits and they will have to get to apartment house style of construction soon. I have seen thick film hybrids with several layers with vertical vias connecting them. I had the thought that if you took the 'bump' technology and made both conducting and non conducting bump connecting pieces you could make two facing(or even more)dice work together. SInce the dice are brittle all bump sites would be in the same places on all dice and the ones that are not used would use a non conducting bump so there would be no bending stress along the die. That way you could have a cache die facing a CPU die and both could be made and tested separately prior to joining up. SInce all bunps would be compressed from both sides there would be no bending stress. Just a thought. Bill