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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Cirruslvr who wrote (77810)	10/29/1999 4:49:00 PM
From: Elmer	Read Replies (2) \| Respond to of 1583857

Re: "Intel has said they will use copper tecnhology with their .13 process. Some people have said that to use copper a new fab needs to built to handle copper contimation (or something like that) and that is the reason AMD's FAB 25 won't be able to use copper. Does anyone know if Intel's current fabs will be able able to use copper? They have a new one coming up in Israel next year so I assume that one is copper ready." What Intel actually said was they won't be using copper until at least .13u. And Intel's Israeli fab is now open and pumping out CuMines. EP

To: Cirruslvr who wrote (77810)	10/29/1999 4:52:00 PM
From: Bill Jackson	Respond to of 1583857

Cirruslvr, I am not sure what is involved in commissioning a FAB area to use the copper damascene process? Is it process water for wash and clean that takes copper ions here and there.....in that case it is easy to solve. Add more pipes and an ion scrubber(carbon aerogel with volts) Is it small particles of copper coating the walls of chambers and later on appearing as traces here and there and screwing up the silicon? Is it the fact that the fab would have to be opened up and new machines shoehorned in? It appears that the portable caddy process would deal with this. Someone did answer this a while back, but I was not that appeased by the amswer. Bill