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Technology Stocks : Amkor Technology Inc (AMKR) -- Ignore unavailable to you. Want to Upgrade?

To: tech101 who wrote (423)	11/3/1999 1:01:00 PM
From: tech101	Read Replies (1) \| Respond to of 1056

AMKR Receives New Patent - Once Again. by: Grim_Fandango69 11/3/1999 10:00 am EST Msg: 9857 of 9860 US Patent #5,977,624 Granted to Amkor Technology, Inc. (Chandler, AZ) on Nov. 2, 1999 Semiconductor package and assembly for fabricating the same Abstract A chip size semiconductor package with a light, thin, simple and compact structure having a reduced size of its semiconductor chip while having an increased number of pins and without degrading its functions. For the package, it is possible to use either the semiconductor chip having bond pads arranged on end portions of the chip or the semiconductor chip having bond pads arranged on the central portion of the chip. In either case, input/output terminals of the package are arranged in the form of an area array. Accordingly, when the package is mounted on an electronic appliance, its mounting area can be minimized, thereby achieving a compactness of the final product.