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Technology Stocks : Amkor Technology Inc (AMKR) -- Ignore unavailable to you. Want to Upgrade?

To: tech101 who wrote (431)	11/10/1999 6:24:00 PM
From: tech101	Respond to of 1056

AMKR Recieves 2 New Patents Yesterday by: Grim_Fandango69 11/10/1999 4:38 pm EST Msg: 9985 of 9997 Once again showing they are the leader in their industry... US Patent #5,981,314 Granted to Amkor Technology, Inc. (Chandler, AZ) on Nov. 9, 1999 Abstract Near chip size integrated circuit package Abstract A plurality of integrated circuit chip (IC chip) packages are fabricated simultaneously from a single insulating substrate having sections. In each section, an IC chip is attached. Bonding pads on the IC chip are electrically connected to first metallizations on a substrate first surface. The first metallizations, IC chip including bonding pads and first substrate surface are then encapsulated. Interconnection balls or pads are formed at substrate bonding locations on a substrate second surface, the interconnection pads or balls being electrically connected to corresponding first metallizations. The substrate and encapsulant are then cut along the periphery of each section to form the plurality of IC chip packages. ----------------------------------------------- US Patent #5,981,873 Granted to Amkor Technology, Inc. (Chandler, AZ) on Nov. 9, 1999 Printed circuit board for ball grid array semiconductor package Abstract A printed circuit board for a BGA semiconductor package provided at one corner thereof with a degating opening serving as a mold runner gate during a process of molding a resin seal adapted to protect the semiconductor chip and serving as a region for degating a surplus resin formed after the molding process and a method for molding a BGA semiconductor using the printed circuit board. The degating opening has an inverted triangular shape having curved lateral sides and a vertex, at which the lateral sides join together, disposed in a region for forming the resin seal, or an inverted trapezoidal shape having one end disposed in the resin seal region. The invention can eliminate the peeling or damage of the upper surface of the printed circuit board occurring upon degating a surplus resin, the damage of the printed circuit board due to a torsion thereof, the damage of conductive traces on the printed circuit board, the exposure of the conductive traces caused by the damage of a solder mask, and the damage of a resin seal on the printed circuit board. Therefore, an improvement in productivity and reliability is achieved.