To: klaus pluszynski who wrote (3567 ) 11/18/1999 11:14:00 AM From: Darin Respond to of 5482
Part 3 of 4 shipments in 2HFY00 have potential for upside beyond the level stated above. The company currently sees no Y2K impact on order demand, the only caveat is Lunar New Year in Asia and a traditional March quarter seasonal slowdown, but that is not expected to impact bookings or shipments at this time. Figure 4: Estimate of KLIC's Wire Bonder Shipments for FY00 1QFY00 2QFY00 3QFY00 4QFY00 Bonders Ships 1050 1150 1250 1350 Source: Prudential Securities estimates. *Assembly subcontractors continue to be KLIC's largest customers. Top Taiwanese subcontractors, such as ASE and Siliconware, continued to be strong customers of KLIC. Amkor was a significant driver of the strong orders in October and is expected to represent an ongoing strength in future quarters. Overall demand from assembly house subcons should continue to grow as world-wide IC volumes grow and packaging technology advances throughout 2000. *Expect continued strength from the packaging material group. In the materials segment, we expect 10% sequential growth, quarter over quarter, throughout 2000. This growth should occur in both the capillary business (40% market share) and in the gold wire business (10% market share). There is moderate upside to these numbers, especially share gains in the gold wire segment. Growth in packaging materials flows nicely to the bottom line as operating margins were 11% in Q4, increasing top-line growth will only add to this leverage. Figure 5: Revenues and Operating Margins for Materials Group FY99 4QFY99 3QFY99 2QFY99 1QFY99 Revenues $36.9M $31.2M $28.8M $27.6M Operation Margins 11.2% 9.5% 8.2% 4.1% Source: Prudential Securities estimates. *Advanced Packaging Technology segment showing signs of improving financials. Though the advanced packaging technology segment of KLIC (XLAM, FCT and Ultra CSP) continues to drag down overall profits, we believe improvement in FCT (Flip Chip Technologies) and Ultra CSP businesses will bring them to break-even by the end of the CY00. XLAM is expected to deliver samples of their advanced laminates in spring 2000, we don't expect commercial production of the XLAM product until late in 2002. We believe the core technology of KLIC's advanced packaging companies are valuable to the future growth of KLIC, and that this should be recognized when evaluating the potential of KLIC going forward 2-3 years. We expect the quarterly losses from APT segment to decline going forward with a goal of break-even by late next year - 2000 should provide us with more visibility into this. *Cost cutting programs, strong demand and less competitive pricing pressure should drive margins over the next several quarters. This is the key investment theme on the stock at the current time. We believe there is tremendous leverage in the Company's P&L. The Company is currently moving production of wire bonders from Willow Grove to Singapore, and we are gaining confidence that this transition is progressing well. The Company will begin initial shipments in the December quarter and ramp to move volume shipments in the March quarter. The Company plans to stop 8028 (KLIC's flagship product) wire bonder production in Willow Grove in the June/July timeframe in 2000. We believe the company can reduce manufacturing costs in Singapore by