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Strategies & Market Trends : The Thread Formerly Known as No Rest For The Wicked -- Ignore unavailable to you. Want to Upgrade?

To: JakeStraw who wrote (73675)	11/18/1999 11:37:00 AM
From: Tim Luke	Read Replies (1) \| Respond to of 90042

VDIM...light my fire

To: JakeStraw who wrote (73675)	11/18/1999 11:37:00 AM
From: CrazyTrain	Read Replies (2) \| Respond to of 90042

Deal with NEC. Could be a real good long term hold. NEC Electronics Selects Dense-Pac Microsystems for Three-Dimensional Technology Business Editors, High Tech Writers GARDEN GROVE, Calif.--(BUSINESS WIRE)--Nov. 18, 1999-- Dense-Pac's stacked technology is designed for use in NEC's high density memory modules, with a value to Dense-Pac in the multi-million dollar range Dense-Pac Microsystems, Inc. (Nasdaq: DPAC), a leading-edge provider of three-dimensional semiconductor packaging, announced today that NEC Electronics, Inc. has selected Dense-Pac as its stacking partner for three-dimensional technology. Deliveries are expected to begin within the next 45 days and extend over the next eighteen months. The stacked DIMMs, which offer a higher density than current non-stacking technology, is currently being used for network servers and computer storage devices. The president and chief executive officer of Dense-Pac Microsystems, Inc., Ted Bruce, said that NEC Electronic's recognition of Dense-Pac's technology is a confirmation of the Company's patented advance, versatile stacking process." "We are working with NEC Electronics to provide the end system manufacturer every advantage of technology, including performance, quality and time to market," said Bruce. The Assistant General Manager of the Memory Business Unit at NEC Electronics, Kevin Krehblel, explained that the Dense-Pac technology of stacking memory provides a highly reliable and efficient method of stacking components. According to Krehblel, "Dense-Pac supports the quality and reliability levels required in higher end systems and is one of the best high density technologies available in the market." Dense-Pac Microsystems, Inc. is a high technology company that specializes in the design of proprietary and patented three-dimensional high-density packaging. The products allow the company's commercial, industrial and aerospace customers to pack large amounts of memory into small spaces. Its commercial products include applications such as network servers, computer storage devices and medical instrumentation. Aerospace and industrial applications can include high performance servers, airborne and space avionics and such diverse areas as satellites, missiles, and high performance servers. The Company's web site is at www.dense-pac.com. Except for historical information, all of the statements, expectations and assumptions contained in the foregoing are "forward-looking statements" (within the meaning of the Private Securities Litigation Reform Act of 1995) that involve a number of risks and uncertainties. It is possible that the assumptions made by management--including, but not limited to, those relating to service offerings, market opportunities, results, performance or expectations--may not materialize. There can be no assurances that the Company's financial goals will be realized. Numerous factors may affect the Company's actual results and may cause results to differ materially. Some of these factors include, without limitation, demand and acceptance of new and existing products, ability to manage large projects, technological and product obsolescence, availability of semiconductor devices at reasonable prices, competitive factors, costs and uncertainties of litigation and the availability of capital to finance growth and working capital needs. These and other risks are discussed in greater detail in the Company's 10-KSB, 10-QSB, or 8-K filings with the Securities and Exchange Commission. --30--skj/cgo* CONTACT: Dense-Pac Microsystems, Garden Grove Yvonne Huff, 714/898-0007 e-mail: yvonneh@dense-pac.com or Wall Street Investor Relations Corp. Joe Zappulla, 301/948-3430 e-mail: JoeZ@WallStreetIR.com KEYWORD: CALIFORNIA INDUSTRY KEYWORD: COMPUTERS/ELECTRONICS Today's News On The Net - Business Wire's full file on the Internet with Hyperlinks to your home page. URL: businesswire.com